Photosensitive Resin Rapid Curing Light-Shielding Optical Components
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Solution Overview
Problem
Existing photosensitive resin compositions used for light-shielding in optical components, such as those in portable electronic devices, face challenges with slow curing rates and inadequate adhesiveness, requiring additional heat treatment and compromising the size reduction and performance of imaging units.
Innovation Solution
A photosensitive resin composition incorporating a cationically polymerizable compound with an alicyclic epoxy group, a photo-cationic polymerization initiator containing a boron atom, and a light-shielding material, along with a hydroxyl-containing compound, which allows for rapid curing and enhanced adhesiveness, including reflow heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light-shielding material is contained in the curable resin, then light-shielding ability is improved, but ultraviolet irradiation is impeded and curing rate deteriorates
Solution Approach 1:
The patent changes the curing mechanism from UV-based to cationic polymerization initiated by visible light or heat, allowing the resin to cure despite the presence of light-shielding materials. This parameter change in the curing method resolves the contradiction between light-shielding ability and curing rate.
Solution Approach 2:
The patent substitutes the UV irradiation mechanism with a cationic polymerization mechanism that can be initiated by visible light or thermal energy. This replacement allows curing to proceed effectively even when UV light is blocked by light-shielding materials.
2Reliability
If additional heat treatment is applied to achieve curing, then curing completeness is improved, but processing time and energy consumption increase
Solution Approach 1:
The cationic polymerization process continues effectively under visible light or heat conditions without requiring separate UV irradiation and heat treatment steps. This continuous curing action reduces total processing time while maintaining curing completeness.
3Volume of moving object
If the imaging unit is thinned for size reduction, then compactness is improved, but heat resistance and reliability deteriorate
Solution Approach 1:
The patent uses a composite resin composition containing cationically polymerizable compounds, photoinitiators, and light-shielding materials that provides both structural integrity and heat resistance in a thinned imaging unit. The composite formulation maintains reliability despite reduced size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables rapid curing and forms a cured product with excellent light-shielding ability and adhesiveness, facilitating the bonding of lenses and forming a light-shielding layer, thereby improving the productivity and thinning of imaging units in electronic appliances.
Implementation Method 1
a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom
Data Source
AI summary
Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows:(A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds;(B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and(C) a light-shielding material.