Photosensitive Resin Composition Suppressing Diol Production
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Solution Overview
Problem
Conventional positive-type photosensitive resin compositions used in liquid crystal displays and organic EL displays face challenges with sensitivity, pattern adhesiveness, and stability over time due to the production of diol compounds, which affect the film retention rate and adhesion to substrates.
Innovation Solution
A photosensitive resin composition comprising an acrylic copolymer, a siloxane copolymer, a 1,2-quinonediazide compound, and a nonpolar organic solvent with a boiling point of 155 to 200°C, which suppresses the reactivity of epoxy groups to reduce diol compound production, enhancing developability, adhesiveness, and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a polysiloxane resin and an acrylic resin are used together as a binder, then sensitivity and adhesiveness are improved, but diol compounds are produced resulting in poor pattern and deterioration in adhesion to substrate
Solution Approach 1:
The patent extracts and removes the harmful diol compounds produced by the reaction between epoxy groups in acrylic resin and H2O molecules in polysiloxane resin. By eliminating this harmful byproduct, the invention maintains the benefits of using both resin types while preventing pattern deterioration and adhesion loss.
Solution Approach 2:
The invention converts the harmful diol compound production into a beneficial outcome by using it as a development promoter. The diol compounds that would normally cause pattern deterioration are instead utilized to enhance developability, transforming a harmful factor into a useful one.
2Manufacturing precision
If the content of binder is adjusted or additive is added to resolve diol compound problem, then pattern adhesiveness is improved immediately, but stability does not continue over time
Solution Approach 1:
The patent applies preliminary action by incorporating specific components (polyol compound, silane compound, or carboxyl-containing compound) into the photosensitive resin composition before the reaction occurs. These pre-added substances prevent diol compound production at the source, ensuring both immediate pattern adhesiveness and long-term stability without requiring post-formulation adjustments.
3Reliability
If epoxy groups in acrylic resin react with H2O molecules in polysiloxane resin, then sensitivity is enhanced, but diol compounds are produced causing poor pattern and adhesion deterioration
Solution Approach 1:
The patent introduces intermediary substances (polyol compounds, silane compounds, or carboxyl-containing compounds) that mediate between the epoxy groups and H2O molecules. These intermediaries prevent direct reaction between epoxy groups and water that produces harmful diol compounds, while still allowing sensitivity enhancement through controlled interaction mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition maintains appropriate developability and adhesiveness while ensuring stability over time, with improved film retention rates at both room and low temperatures, suitable for use in liquid crystal displays and organic EL displays.
Implementation Method 1
a nonpolar organic solvent having a boiling point of 155 to 200° C. at 25° C. and 1 atm... suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds
Implementation Method 2
(C) a 1,2-quinonediazide compound
Data Source
AI summary
The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.