Photosensitive Resin Composition for Stripper-Resistant Fine Patterns
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Solution Overview
Problem
Existing photosensitive silicone compositions used for semiconductor devices and multilayer printed circuit boards suffer from poor chemical resistance against photoresist strippers, limited fine pattern formation, and reliability issues, particularly in moisture resistance and adhesion to substrates.
Innovation Solution
A photosensitive resin composition comprising a polymer with a silphenylene, polysiloxane, and fluorene skeleton, combined with specific crosslinkers and a photoacid generator, which forms a cured coating with improved copper migration resistance, photoresist stripper resistance, adhesion, and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive silicone composition is used to achieve moisture resistance and adhesion, then reliability is improved, but chemical resistance against photoresist strippers deteriorates
Solution Approach 1:
The patent employs a composite resin system combining silphenylene skeleton-containing silicone polymer, polysiloxane, and fluorene-containing polymer. This multi-component composite structure achieves synergistic effects where the silphenylene-silicone base provides moisture resistance and adhesion, while the fluorene-containing polymer and crosslinking agents enhance chemical resistance against photoresist strippers, resolving the contradiction between reliability and chemical resistance.
Solution Approach 2:
The patent modifies the chemical structure parameters by introducing specific crosslinking mechanisms (isocyanate, carboxyl, acid anhydride groups) and controlling the molecular weight and composition ratios of the polymer components. These parameter changes enable the resin to maintain its moisture resistance and adhesion properties while significantly improving resistance to photoresist strippers through enhanced crosslink density and chemical structure optimization.
2Ease of manufacture
If conventional photosensitive resin compositions are used, then processing is simplified, but fine pattern formation capability deteriorates
Solution Approach 1:
The patent optimizes the viscosity and molecular weight parameters of the resin composition to enable fine pattern formation. By controlling the polymer chain length and crosslinking density, the resin achieves appropriate flow characteristics for precise patterning while maintaining ease of application through simple coating processes. The balanced parameter selection allows both fine pattern resolution and straightforward manufacturing.
3Ease of manufacture
If photosensitive silicone composition is used to achieve low temperature curing, then ease of manufacture is improved, but chemical resistance against high dissolving power photoresist strippers deteriorates
Solution Approach 1:
The patent creates a composite curing system where the silphenylene-silicone polymer provides low-temperature curability through its inherent silicone chemistry, while the incorporated fluorene-containing polymer and multiple crosslinking mechanisms (isocyanate, carboxyl, acid anhydride) collectively provide enhanced chemical resistance. This composite approach allows low-temperature processing without sacrificing resistance to strong photoresist strippers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of a coating with excellent perpendicularity and reliability, providing enhanced adhesion, chemical resistance, and heat resistance, suitable for protecting electric and electronic parts, especially circuit boards and semiconductor devices.
Implementation Method 1
a photoacid generator
Data Source
AI summary
The photosensitive resin composition includes (A) a polymer having a silphenylene skeleton, a polysiloxane skeleton, and a fluorene skeleton in a main chain, and containing a polyhydric alcohol structure in a side chain, (B) a crosslinker of specific structure, and (C) a photoacid generator. The photosensitive resin composition gives a resin coating or resin layer that can be simply processed in thick film form to define a fine size perpendicular pattern.