Photosensitive Resin Composition for HF Acid Etching
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Solution Overview
Problem
Conventional photosensitive resin compositions exhibit insufficient resistance to highly concentrated etching solutions containing hydrofluoric acid or ammonium fluoride, leading to peeling of the resist pattern from glass substrates during etching processes.
Innovation Solution
A photosensitive resin composition comprising acid-modified epoxy acrylate, a photopolymerization initiator, a blocked isocyanate compound, and a filler, specifically talc, which forms a strong, thermally crosslinked film resistant to etching solutions, preventing peeling even in highly concentrated hydrofluoric acid or ammonium fluoride solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive resin compositions are used, then the etching process can be performed, but the resist pattern peels off from the glass substrate when exposed to highly concentrated etching solutions containing 15 mass % or more hydrofluoric acid or ammonium fluoride
Solution Approach 1:
The patent uses a composite resin composition containing multiple components: carboxyl group-containing binder resin, silane-modified binder resin, photopolymerizable monomer, and inorganic filler. This composite structure creates synergistic effects where the carboxyl groups provide chemical bonding to glass, the silane-modified resin forms crosslinked networks for mechanical strength, and the inorganic filler enhances chemical resistance, collectively preventing peeling in highly concentrated etching solutions
Solution Approach 2:
The patent modifies the chemical parameters of the resin composition by incorporating specific functional groups (carboxyl groups with controlled content of 1-50 mmol/g, silane-modified components) and adjusting the composition ratios of different resins and fillers. These parameter changes enhance the resin's chemical resistance and adhesion properties, enabling it to withstand highly concentrated etching solutions without peeling
2Reliability
If the resin composition contains sufficient components for adhesion, then the resist pattern maintains adhesion, but the resistance to highly concentrated etching solution is still insufficient
Solution Approach 1:
The patent designs resin components that perform multiple functions simultaneously. For example, the carboxyl group-containing binder resin provides both adhesion to the glass substrate through chemical bonding and structural integrity. The silane-modified binder resin contributes to both crosslinked network formation for mechanical strength and chemical resistance. The inorganic filler serves both as a structural reinforcement and as a barrier against etching solution penetration, reducing the need for separate functional additives
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent resistance to etching solutions, preventing peeling and maintaining pattern integrity during etching with solutions containing 15 mass % or more hydrofluoric acid or ammonium fluoride, ensuring effective substrate processing.
Implementation Method 1
a photopolymerization initiator
Implementation Method 2
a blocked isocyanate compound
Data Source
AI summary
The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.