Photosensitive Resin Composition for Interlayer Dielectric Films
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Solution Overview
Problem
Current photosensitive resin compositions used in electronic parts and liquid crystal displays face challenges with developability, storage stability, heat resistance, adhesion, and electrical characteristics, particularly in forming interlayer dielectric films, microlenses, light diffusive and reflective films, and alignment control protrusions.
Innovation Solution
A photosensitive resin composition comprising a copolymer of hydroxyphenyl (meth)acrylate and unsaturated epoxy compounds, combined with a novolac resin obtained by polycondensation of phenols with formaldehyde, and a quinonediazide group-containing compound, which provides improved transparency, heat resistance, and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photosensitive resin compositions are used for forming interlayer dielectric films, then basic film formation is achieved, but developability, storage stability, heat resistance, adhesion, and electrical characteristics are insufficient
Solution Approach 1:
The patent employs a composite resin system combining (meth)acrylic resin, epoxy resin, and phenolic resin in specific ratios. This multi-component composite approach synergistically improves developability through (meth)acrylic resin, heat resistance through phenolic resin, and adhesion through epoxy resin, while achieving all required performance characteristics simultaneously rather than through complex processing adjustments
Solution Approach 2:
The patent specifies precise compositional parameters: (meth)acrylic resin 20-80 parts by weight, epoxy resin 10-50 parts by weight, and phenolic resin 10-50 parts by weight. By controlling these material composition parameters within defined ranges, the invention achieves optimal balance of developability, storage stability, heat resistance, adhesion, and electrical characteristics without increasing process complexity
2Reliability
If photosensitive resin compositions are used for forming microlenses, then light collection properties are achieved, but transparency, melt flow properties, heat resistance, and high refractive index requirements cannot be simultaneously met
Solution Approach 1:
The patent uses a composite system of (meth)acrylic resin, epoxy resin, and phenolic resin that collectively provides the required optical and thermal properties. The (meth)acrylic resin contributes to refractive index and transparency, epoxy resin provides heat resistance and adhesion, while phenolic resin enhances thermal stability. This composite approach achieves multiple optical requirements simultaneously without increasing formulation complexity
Solution Approach 2:
The patent ensures homogeneous distribution and compatibility among the different resin components through careful selection of compatible materials and proportions. This homogeneity prevents phase separation during storage and processing, maintaining consistent optical properties including transparency and refractive index throughout the microlens structure
3Illumination intensity
If photosensitive resin is used for forming light diffusive and reflective films, then axial brightness is improved, but heat resistance for metal sputtering and solvent resistance are required
Solution Approach 1:
The patent combines phenolic resin (providing heat resistance for metal sputtering), epoxy resin (providing solvent resistance), and (meth)acrylic resin (providing optical properties for light diffusion and reflection). This composite system simultaneously achieves the required thermal stability, chemical resistance, and optical performance for light diffusive and reflective films
4Ease of operation
If photosensitive resin compositions are used for forming alignment control protrusions, then liquid crystal vertical alignment is achieved, but resistance to solvents and heat during alignment film formation is required
Solution Approach 1:
The patent uses epoxy resin (10-50 parts by weight) which provides excellent solvent resistance, and phenolic resin (10-50 parts by weight) which provides heat resistance. This composite system allows the alignment control protrusions to withstand subsequent alignment film formation processes involving solvents and heat treatment while maintaining their structural integrity and alignment control functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent developability, storage stability, and adhesion, while maintaining transparency and heat resistance, making it suitable for various applications including protective films, planarization films, and optical waveguides.
Implementation Method 1
quinonediazide group-containing compound
Implementation Method 2
copolymer of hydroxyphenyl (meth)acrylate and unsaturated epoxy compounds
Data Source
AI summary
Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4′-dihydroxy-2,2′-diphenylpropane (C) a quinonediazide group-containing compound.