Photosensitive Resin Composition for High-Resolution Liquid-Repellent Films
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Solution Overview
Problem
Silicone-based water-repellent materials exhibit inadequate reactivity and crosslink density, leading to poor liquid repellency and resolution during patterning, especially in inkjet recording heads, which affects print quality over time.
Innovation Solution
A photosensitive resin composition comprising specific epoxy resins and a cationic polymerization catalyst, such as sulfonium salts, is used to enhance reactivity and achieve high liquid repellency and resolution during patterning, forming a durable liquid-repellent anti-fouling film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If silicone compounds are used as water-repellent materials, then environmental safety is improved, but reactivity and crosslink density are insufficient
Solution Approach 1:
The patent uses composite materials by combining silicone compounds with epoxy resins in a photosensitive resin composition. This composite approach allows the material to maintain the environmental safety of silicone while gaining the reactivity and crosslinking capability of epoxy resins through photopolymerization.
Solution Approach 2:
The patent changes the chemical composition parameters by incorporating specific ratios of silicone compounds (0.1-10 mass%) and epoxy resins with different epoxy equivalents (50-500 g/eq) into the photosensitive resin composition, optimizing both reactivity and liquid repellency properties.
2Reliability
If photoexposure dose or photopolymerization initiator is increased to improve crosslink density, then liquid repellency is improved, but resolution during patterning deteriorates
Solution Approach 1:
The patent optimizes the epoxy equivalent parameter of the epoxy resin (50-500 g/eq) and the photoexposure dose (100-1000 mJ/cm²) to achieve the desired balance between crosslink density and patterning resolution, avoiding the need to excessively increase initiator concentration.
Solution Approach 2:
The patent discards the conventional approach of simply increasing photopolymerization initiator concentration and instead recovers optimal performance by adjusting the epoxy resin characteristics and photoexposure parameters.
3Duration of action of stationary object
If crosslink density is increased to improve liquid repellency, then durability is improved, but patterning resolution deteriorates
Solution Approach 1:
The patent creates a composite photosensitive resin composition that achieves both high crosslink density for durability and good patterning resolution through the synergistic combination of silicone compounds, epoxy resins, and photopolymerization initiators.
Solution Approach 2:
The patent changes the chemical structure parameters by selecting epoxy resins with specific epoxy equivalents (50-500 g/eq) and controlling the silicone compound content (0.1-10 mass%) to achieve optimal crosslink density without compromising patterning resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures high liquid repellency and good resolution during patterning, maintaining print quality in inkjet recording heads over long-term use.
Implementation Method 1
a photosensitive resin composition comprising a silicone compound and an epoxy resin, and a cationic polymerization catalyst
Implementation Method 2
silicone compounds are water-repellent materials that do not comprise fluorine, but which still exhibit an excellent liquid repellency
Data Source
Figure 1A~1B
Figure 2A~2H
Figure 3A~3C
AI summary
A photosensitive resin composition comprising: an epoxy resin (A) represented by formula (1); an epoxy resin (B) that has an epoxy equivalent of 500 g/eq. or less and that is different from the epoxy resin (A) represented by formula (1); and a cationic polymerization catalyst, where, in formula (1), R1, R2, R3, R4, and X1 are each independently an alkyl group with carbon numbers of 1 to 12, an aryl group with carbon numbers of 6 to 12, or an epoxy-comprising group; X2 is an epoxy-comprising group; m + n is an integer from 1 to 60; and a sequence of a structure of parentheses marked with m and a sequence of a structure of parentheses marked with n may be random or block.