Photosensitive Resin for 193 nm Lithography Resolution
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Solution Overview
Problem
Current photosensitive compositions face challenges in forming fine patterns with line widths of less than 100 nm, particularly in terms of resolution and line edge roughness, which can lead to failures in electric characteristics and reduced yield due to irregular edge fluctuations during the etching process.
Innovation Solution
A photosensitive composition comprising a resin with specific repeating units that increase solubility in alkaline developers, featuring hydroxyl groups, lactone structures, and acid-decomposable groups, which are designed to improve resolution and line edge roughness by enhancing the chemical amplification process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a light source with shorter wavelength (e.g., ArF excimer laser at 193 nm) is used, then resolution is improved, but absorption by aromatic groups increases leading to poor performance
Solution Approach 1:
The patent changes the chemical structure parameters of the resin by replacing aromatic groups with alicyclic hydrocarbon structures. This structural parameter change allows the resin to maintain transparency at 193 nm wavelength while preserving the desired optical and mechanical properties, thereby resolving the contradiction between achieving high resolution and avoiding harmful absorption.
Solution Approach 2:
The patent employs composite resin systems combining alicyclic hydrocarbon structures with specific functional groups (carboxyl, hydroxyl, ether, ester). This composite approach creates a material that simultaneously achieves the required transparency to 193 nm light and provides adequate adhesion, etch resistance, and pattern formation capability.
2Manufacturing precision
If fine patterns with line width of not more than 100 nm are formed, then resolution is improved, but line edge roughness increases causing failure of electric characteristics
Solution Approach 1:
The patent introduces specific functional groups (carboxyl groups with content of 0.1-5.0 mmol/g) at local positions within the resin structure to enhance edge definition and reduce line edge roughness. This localized functional group distribution improves the interface quality between resist and substrate without compromising the overall fine pattern resolution.
Solution Approach 2:
The patent optimizes multiple parameters including carboxyl group content (0.1-5.0 mmol/g), hydroxyl group content (0.5-10.0 mmol/g), and molecular weight distribution to achieve both high resolution and smooth line edges. By carefully controlling these compositional parameters, the resist maintains reliability in electric characteristics while forming fine patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent resolution and reduced line edge roughness in forming fine patterns, thereby improving the electrical characteristics and yield by stabilizing the edge interface between the resist and substrate.
Implementation Method 1
A chemical amplification type photosensitive composition is a pattern forming material in which radiations such as far ultraviolet light are irradiated to generate an acid in the exposed area, a reaction using this acid as a catalyst changes solubility in a developer between an active radiation-irradiated area and a non-irradiated area
Implementation Method 2
a reaction using this acid as a catalyst changes solubility in a developer between an active radiation-irradiated area and a non-irradiated area
Implementation Method 3
in which radiations such as far ultraviolet light are irradiated to generate an acid in the exposed area
Data Source
AI summary
A positive working photosensitive composition which is useful in the manufacturing step of a semiconductor such as IC, the manufacture of a circuit board such as liquid crystals and thermal heads, and other fabrication steps and has an excellent resolution and line edge roughness, and a method for forming a pattern using the same, are provided, which are a photosensitive composition containing (A) a resin having a repeating unit having a specific group, whose solubility in an alkaline developer increases by the action of an acid, and a method for forming a pattern using the same.