Positive Photosensitive Resin Composition for Lithography

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Solution Overview

Problem

The existing positive photosensitive polyimide precursor compositions used in semiconductor device manufacturing have low sensitivity and resolution, necessitating the development of a composition that enhances lithography performance.

Innovation Solution

A positive photosensitive resin composition is developed by combining a hydroxypolyamide with a terpene compound and a photo-acid generator, specifically using a terpene compound with functional groups like alcoholic hydroxyl, carbonyl, or carboxyl groups, and a naphthoquinonediazide structure, to improve sensitivity and resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a PBO precursor composition is used as a positive photosensitive resin composition, then the composition can be developed with an alkaline aqueous solution, but the sensitivity is low compared to photosensitive polyimide precursor composition

Engineering Contradiction:

Improvedevelopability with alkaline aqueous solutionVSAvoidsensitivity

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The invention uses a composite material system combining hydroxypolyamide (PBO precursor) with a specific terpene compound (citronellic acid or linalool) and photo-acid generator. This composite approach allows the material to maintain alkaline solution developability while achieving improved sensitivity through the synergistic interaction of components, particularly the terpene compound that enhances photochemical response.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention modifies the chemical parameters of the PBO precursor composition by introducing specific terpene compounds (citronellic acid with carboxyl group, linalool with hydroxyl group) at controlled concentrations (0.01-10 parts by mass per 100 parts PBO precursor). This parameter change optimizes the balance between developability and sensitivity by altering the photochemical and chemical properties of the composition.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If organic solvent is used for development, then the developing process is effective, but environmental concerns increase

Engineering Contradiction:

Improvedeveloping effectivenessVSAvoidenvironmental pollution

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention replaces the organic solvent-based development system with an aqueous alkaline solution-based development system. The photo-acid generator and terpene compound enable the PBO precursor to be developed using alkaline aqueous solution instead of organic solvents, eliminating environmental pollution while maintaining developing effectiveness through controlled dissolution rates.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If the terpene compound content is increased to improve sensitivity, then lithography performance improves, but the composition complexity increases

Engineering Contradiction:

Improvelithography performanceVSAvoidcomposition complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention optimizes the concentration parameter of the terpene compound within a specific range (0.01-10 parts by mass per 100 parts PBO precursor). This parameter optimization achieves improved lithography performance (sensitivity and resolution) while avoiding excessive composition complexity by maintaining the terpene compound at controlled, manageable levels rather than high concentrations.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves improved sensitivity and resolution in lithography, enabling the formation of high-quality cured relief patterns suitable for semiconductor devices, with reduced undeveloped residues and enhanced tensile elongation of the cured film.

Implementation Method 1

a photo-acid generator and a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units represented by the general formula (1) below

Methodology Applied

Scientific EffectPhoto-acid generation: Photopolymerisation

Implementation Method 2

the exposure induces the chemical change of the photosensitive diazoquinone compound into an indene carboxylic acid compound to increase the rate of dissolution of exposed areas in the alkaline aqueous solution

Methodology Applied

Scientific EffectPhotochemical reaction: Photopolymerisation

Implementation Method 3

heat produces the formation of an oxazole ring to allow a PBO film after curing to come to have heat-cured film characteristics comparable to those of a polyimide film

Methodology Applied

Scientific EffectThermal curing: Heat Treatment

Implementation Method 4

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentUS7674566B2Positive photosensitive resin composition

Publication Date: 2010.03.09 ASAHI KASEI EMD CORP

AI summary

The present invention provides a positive photosensitive resin composition, characterized by comprising 1 to 50 parts by mass of a photo-acid generator and 0.01 to 70 parts by mass of a terpene compound in combination with 100 parts by mass of a hydroxypolyamide having repeating units. A terpene compound can be combined with a hydroxypolyamide having a particular structure to provide a positive photosensitive resin composition excellent in positive lithography performance such as sensitivity and resolution.