Negative Photosensitive Resin Composition for Low-Loss Patterning
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Solution Overview
Problem
Conventional photosensitive resin compositions face challenges in improving pattern formability by development, reducing dielectric loss tangent, and enhancing chemical resistance and extensibility of resin films.
Innovation Solution
A negative photosensitive resin composition containing a polymer with specific structural units and a photo-radical generator, such as acylphosphine oxide or oxime ester, is used to improve pattern formability and reduce the dielectric loss tangent of the resin film, while increasing chemical resistance and extensibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional photosensitive resin composition containing a cycloolefin resin with a polymerizable double bond in a side chain is used, then the resin film can be formed, but the pattern formability by development is insufficient
Solution Approach 1:
The patent modifies the chemical structure of the polymer by introducing specific structural units (I) and (II) with controlled ratios. Structural unit (I) contains a polymerizable double bond with specific substituents (R1-R4) and an alkylene group (X) with carbon number 1-10, while structural unit (II) provides a different chemical environment. By changing the molecular structure parameters and compositional ratios of these units, the resin achieves both good pattern formability and development performance simultaneously
Solution Approach 2:
The patent creates a composite polymer structure combining two distinct structural units (I) and (II) in specific proportions. Structural unit (I) contributes to crosslinking reactivity and pattern formability through its polymerizable double bond, while structural unit (II) modifies the overall resin properties. This composite approach allows the resin film to exhibit both excellent pattern formability and development characteristics that neither unit could achieve alone
2Manufacturing precision
If the resin composition is optimized for pattern formability, then development performance improves, but the dielectric loss tangent increases
Solution Approach 1:
The patent carefully controls the compositional ratio of structural units (I) and (II) in the polymer. By adjusting these ratio parameters, the resin achieves optimal balance between pattern formability (requiring certain crosslinking density) and dielectric loss tangent (requiring lower polarity and molecular mobility). The specific structural design of units (I) and (II) with their respective substituents (R1-R4, R5-R8) and alkylene groups allows fine-tuning of dielectric properties while maintaining pattern formation capability
3Manufacturing precision
If the resin composition is optimized for pattern formability, then development performance improves, but chemical resistance and extensibility deteriorate
Solution Approach 1:
The patent designs a composite polymer structure where structural unit (I) with polymerizable double bonds provides crosslinking sites for pattern formability, while structural unit (II) contributes to chemical resistance and extensibility. The synergistic combination of these two structural units in specific ratios enables the resin film to simultaneously achieve excellent pattern formability, chemical resistance to solvents and etchants, and extensibility for mechanical stress relief
Solution Approach 2:
The patent modifies the chemical structure parameters of the polymer by introducing specific functional groups and substituents in structural units (I) and (II). The alkylene group (X) with carbon number 1-10 and the various substituent groups (R1-R4, R5-R8) are carefully selected to optimize the balance between crosslinking density (for pattern formability) and chain flexibility/chemical stability (for extensibility and chemical resistance)
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved pattern formability, reduced dielectric loss tangent, and enhanced chemical resistance and extensibility of the resin film, making it suitable for electronic components like integrated circuits and organic EL elements.
Implementation Method 1
a negative photosensitive resin composition comprises a polymer and a photo-radical generator
Implementation Method 2
a photo-radical generator, wherein the polymer includes a structural unit (I) represented by formula (I)
Data Source
AI summary
Provided is a negative photosensitive resin composition. The negative photosensitive resin composition contains a polymer and a photo-radical generator. The polymer includes a structural unit (I) represented by formula (I), shown below, and a structural unit (II) represented by formula (II), shown below. In formula (I), R1 to R3 each indicate, independently of one another, a hydrogen atom, an alkyl group, or an aromatic ring group, R1 to R3 may be bonded to form a ring, R4 indicates a hydrogen atom or an alkyl group, X indicates an alkylene group having a carbon number of 1 to 10, and m indicates 0, 1, or 2. In formula (II), R5 to R8 each indicate, independently of one another, a hydrogen atom, an alkyl group, or an aromatic ring group, R5 to R8 may be bonded to form a ring, and n indicates 0, 1, or 2.