Photosensitive composition, cured product, electronic component, and method for producing cured product
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Solution Overview
Problem
Existing photosensitive compositions fail to provide cured products with excellent mechanical properties and migration resistance while suppressing development residues, especially when heated at low temperatures.
Innovation Solution
A photosensitive composition containing specific resins and additives, including imide, amide, and siloxane structures, with controlled amounts of organic acids and anions, promotes cross-linking and ring-closing reactions, enhancing mechanical properties and migration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a photosensitive composition is heated at a low temperature to reduce manufacturing complexity, then the curing process becomes simpler, but the mechanical properties and migration resistance of the cured product deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive material by incorporating specific resins (polyimide, polybenzoxazole, polyamideimide) and cross-linking agents that enable effective cross-linking reactions at lower temperatures (200-250°C), thereby maintaining mechanical strength while reducing curing temperature requirements
Solution Approach 2:
The patent creates a composite material system combining multiple resin types (polyimide, polybenzoxazole, polyamideimide) with cross-linking agents and specific additives, where the synergistic interaction of components enables both low-temperature curing and high mechanical properties through enhanced cross-linking density
2Ease of manufacture
If a photosensitive composition is heated at a low temperature to improve ease of manufacture, then the processing becomes simpler, but the migration resistance of the cured product deteriorates
Solution Approach 1:
The patent modifies the chemical parameters by introducing specific cross-linking agents and resin combinations that achieve sufficient cross-linking density at lower temperatures, preventing ion migration pathways while maintaining processing simplicity through reduced curing temperature requirements
Solution Approach 2:
The patent uses cross-linking agents as intermediary substances that facilitate the formation of a dense cross-linked network structure at low temperatures, which acts as a barrier to ion migration while allowing the curing process to proceed under milder conditions
3Manufacturing precision
If development residues are suppressed by optimizing the photosensitive composition, then the purity of the cured product improves, but the mechanical properties deteriorate
Solution Approach 1:
The patent optimizes the compositional parameters by carefully balancing the ratios of resins, cross-linking agents, and additives to achieve complete reaction conversion that eliminates development residues while simultaneously forming a dense cross-linked network that maintains mechanical strength
Solution Approach 2:
The patent employs a composite formulation where multiple resin systems work synergistically with cross-linking agents to achieve both complete development (residue-free) and high mechanical properties through the combined effects of different polymer matrices and cross-linking structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a cured product with suppressed residues and excellent mechanical properties at low temperatures, along with improved migration resistance for electronic components.
Implementation Method 1
promotes cross-linking and ring-closing reactions, enhancing mechanical properties and migration resistance
Implementation Method 2
promotes cross-linking and ring-closing reactions, enhancing mechanical properties and migration resistance
Implementation Method 3
containing a binder resin (A) and a photosensitizer (C)
Data Source
Figure 1
AI summary
The purpose of the present invention is to provide a cured product that can suppress the presence of residues post-development and that, due to an enhanced degree of resin crosslinking and a promotion of ring-closing reactions, exhibits excellent mechanical properties even with heating at low temperatures. Another purpose of the present invention is to provide a cured product that is provided to an electronic component that exhibits an excellent migration resistance. The present invention is a photosensitive composition that satisfies the following condition (α) and contains a binder resin (A) and a photosensitizer (C) and also contains a radically polymerizable compound (B) and/or a crosslinking agent (F), wherein the binder resin (A) contains the following resin (A1) and/or resin (A2). resin (A1): a resin that contains, in the structural units in the resin main chain, at least one selected from the group consisting of the imide structure, amide structure, oxazole structure, and siloxane structure; resin (A2): a resin having a phenolic hydroxyl group in the structural units in the resin main chain; and (α) a content of at least one selected from the group consisting of sulfonic acids, phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, phosphinic acid, hypophosphite esters, and carboxylic acids containing the element fluorine, wherein the total of the content of these organic acids is in a prescribed range.