Photosensitive Resin Micro Pattern Manufacturing
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Solution Overview
Problem
Existing methods for imparting solvent resistance to photosensitive resin materials for micro pattern manufacturing, such as those used in semiconductor and display panels, face challenges with decomposition or volatilization of fluorine compounds during high-temperature curing, leading to degraded coating and patterning properties due to low compatibility with organic resins.
Innovation Solution
A micro pattern manufacturing method using a photosensitive resin compound comprising epoxy resin, a fluorine compound with a boiling or sublimation point of 200° C. or higher, and an ester solvent, where the ester solvent constitutes at least 5% of the total solvent by mass, to enhance swelling resistance and compatibility, ensuring high pattern accuracy and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature heat processing is used in the curing process to improve swelling resistance, then the solvent resistance of the curable substance is improved, but the fluorine compound decomposes or volatilizes leading to degraded coating and patterning properties
Solution Approach 1:
The patent changes the molecular weight parameter of the fluorine compound to be 400 or more, which fundamentally alters the thermal stability characteristics. This parameter change prevents volatilization during high-temperature curing while maintaining the desired swelling resistance, resolving the contradiction between improving reliability and preventing substance loss.
Solution Approach 2:
The patent creates a composite photosensitive resin composition combining epoxy resin with high molecular weight fluorine compounds and specific solvents. This composite material achieves both high swelling resistance and coating stability by synergistically integrating components with complementary properties, where the fluorine compound provides solvent resistance and the epoxy resin matrix provides structural integrity.
2Reliability
If the addition amount of fluorine compound is increased to maintain performance after high-temperature processing, then the swelling resistance is maintained, but the compatibility with organic resins decreases leading to degraded coating property and patterning
Solution Approach 1:
The patent changes multiple parameters simultaneously: fluorine compound molecular weight (≥400), epoxy equivalent (200-1000), and solvent composition (ester solvent ≥5%). These coordinated parameter changes enable achieving both high swelling resistance and excellent patterning accuracy by optimizing the balance between fluorine compound content and material compatibility.
Solution Approach 2:
The patent applies local quality by introducing specific functional groups and molecular weight characteristics in different components of the photosensitive resin. The high molecular weight fluorine compound provides localized swelling resistance while the epoxy resin matrix and ester solvent ensure localized compatibility and patterning quality, achieving both requirements through spatially differentiated material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high pattern accuracy and mechanical strength, suitable for diverse high-tech applications, including liquid discharge heads, by preventing fluorine compound volatilization and maintaining solvent resistance, thereby improving the performance of micro patterns in liquid-contacting environments.
Implementation Method 1
the photosensitive resin layer is formed by using a photosensitive resin compound containing an epoxy resin, a fluorine compound, a photocationic polymerization initiator
Implementation Method 2
a boiling or sublimation point of the fluorine compound is 200° C. or higher
Data Source
AI summary
A micro pattern manufacturing method includes a first process for forming a photosensitive resin layer on a substrate, and a second process for exposing and developing the photosensitive resin layer to form a micro pattern, wherein the photosensitive resin layer is formed by using a photosensitive resin compound containing an epoxy resin, a fluorine compound, a photocationic polymerization initiator, and a solvent, and wherein a boiling or sublimation point of the fluorine compound is 200° C. or higher, the solvent contains an ester solvent, and a ratio of the ester solvent to the entire solvent is equal to or larger than 5% by mass.