Positive Photosensitive Resin Composition for Scum-Free OLED Patterning
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Solution Overview
Problem
Conventional polyamic esters used in polyimide photosensitive resin compositions face challenges with solubility control and low sensitivity, making them unsuitable for efficient use in OLED devices.
Innovation Solution
A positive photosensitive resin composition comprising specific polyimide precursors with structural units and a quinonediazide compound, along with a solvent, to enhance solubility control and sensitivity, while preventing scum and cracks during pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional polyimide photosensitive resin compositions are used for pattern formation in display devices, then the organic insulating film can be formed, but scum and cracks are generated during the patterning process
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive resin by incorporating polyimide precursors with specific structural units that have improved chemical resistance and adhesion properties. This parameter change prevents the generation of scum and cracks during patterning, thereby improving pattern formation quality.
Solution Approach 2:
The patent uses a carefully formulated resin composition that prevents defects during the single-use patterning process. The optimized composition ensures that the film remains intact and free from scum and cracks during the brief but critical patterning operation, eliminating the need for rework or additional defect correction steps.
2Ease of operation
If the polyimide precursor structure is modified to improve solubility, then solubility control becomes easier, but sensitivity may be compromised
Solution Approach 1:
The patent introduces specific structural parameters into the polyimide precursor molecules, including ether oxygens in the side chains and hydroxyl groups at controlled positions. These parameter changes enhance solubility in conventional solvents while maintaining or improving photosensitivity, as the structural modifications are designed to affect both properties simultaneously in a balanced manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition improves sensitivity, chemical resistance, and adhesion, reducing the occurrence of scum and cracks in OLED devices, thereby enhancing the manufacturing process efficiency.
Implementation Method 1
5 to 50 parts by weight of a quinonediazide compound per 100 parts by weight of the polymer resin
Data Source
AI summary
A positive photosensitive resin composition includes a polymer resin, a quinonediazide compound, and a solvent. The polymer resin includes (i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 2, and iii) 0 to 20 wt. % of a polyimide precursor having a structural unit represented by Formula 3. The quinonediazide compound is included in an amount of 5 to 50 parts by weight per 100 parts by weight of the polymer resin. The solvent is included in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the polymer resin.