Photosensitive Resin Composition for Accurate Pattern Formation

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Solution Overview

Problem

Conventional photosensitive resin compositions for protective films in electronic elements, such as TFT liquid crystal displays, suffer from poor resistance to development, leading to inaccuracies in pattern formation and reduced performance.

Innovation Solution

A photosensitive resin composition comprising an alkali-soluble resin, ortho-naphthoquinone diazide sulfonic acid ester, and a solvent, specifically including a fluorene derivative with a double-bond group and an unsaturated compound with an acid-decomposable group, which are copolymerized to enhance development resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional photosensitive resin compositions are used to enhance compactness, then the protective film achieves better compactness, but the resistance to development deteriorates

Engineering Contradiction:
Improvecompactness of protective filmVSAvoidresistance to development
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent employs a composite resin system combining multiple components: (1) a resin with acid-labile protecting groups (e.g., carbonyl, carboxyl, or ester groups) that provide both compactness and development resistance, (2) a crosslinking agent containing a ring structure with a double bond, and (3) a photopolymerization initiator. This composite approach allows the protective film to achieve both compactness through the acid-labile resin and development resistance through the crosslinked network formed by the ring-containing crosslinking agent, resolving the contradiction between these two properties.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the chemical structure parameters of the resin composition by introducing specific functional groups (acid-labile protecting groups) and controlling the molecular structure of the crosslinking agent (ring structure with double bond). By changing these chemical parameters, the resin achieves both compactness and enhanced development resistance, as the crosslinked network formed during photopolymerization prevents dissolution while maintaining the compact structure.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If photosensitive resin composition is used to improve pattern accuracy, then the desired pattern accuracy is achieved, but the development resistance deteriorates

Engineering Contradiction:
Improveaccuracy of desired patternsVSAvoidresistance to development
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The composite resin system provides both pattern accuracy and development resistance. The acid-labile resin component enables precise pattern formation through controlled photopolymerization, while the crosslinking agent with ring structure creates a robust network that resists development, ensuring the accuracy of the desired patterns is maintained throughout the manufacturing process.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The crosslinking agent is incorporated into the resin composition in advance, forming a crosslinked network structure before pattern formation. This preliminary crosslinking action creates a stable framework that maintains pattern accuracy during subsequent processing and development steps, preventing degradation of the desired patterns.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition significantly improves the resistance to development, resulting in more accurate pattern formation and enhanced performance of the protective films in electronic elements.

Implementation Method 1

a photosensitive resin composition comprising an alkali-soluble resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a solvent (C)

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS9422446B2Photosensitive resin composition, protective film and element having the same
Publication Date: 2016.08.23 CHI MEI CORP
  • US9422446B2 patent drawing
  • US9422446B2 patent drawing
  • US9422446B2 patent drawing

AI summary

The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes an alkali-soluble resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a solvent (C). The alkali-soluble resin (A) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (a1), a fluorene derivative having a double-bond group (a2) and an unsaturated compound having an acid-decomposable group (a3).