Photosensitive Resin Composition for Fine Pattern Resolution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional photosensitive resin compositions face challenges in forming fine, intricate patterned cured films with excellent heat resistance and impact resistance, as they tend to dissolve and change pattern shape and dimensions during the curing process, leading to issues with pattern melt and residue generation during development.
Innovation Solution
A photosensitive resin composition comprising an alkali-soluble resin with phenolic hydroxyl groups, a light-generated acid compound, and an acrylic resin with crosslinking capabilities, specifically using structural units that crosslink with the alkali-soluble resin, along with a heat acid generator and thermal crosslinking agents, to enhance developability, mechanical properties, and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive resin composition is used for forming fine patterns, then sensitivity and resolution can be improved, but pattern melt occurs during curing causing shape and dimension changes
Solution Approach 1:
The patent applies preliminary action by incorporating a crosslinking agent into the photosensitive resin composition before the curing process. This crosslinking agent forms a preliminary crosslinked network structure during exposure and development that stabilizes the pattern shape before the final curing step, preventing pattern melt during heating.
Solution Approach 2:
The patent uses composite materials by combining the photosensitive resin with a specific crosslinking agent that has both crosslinking functionality and heat resistance. This composite composition provides both the sensitivity/resolution needed for fine patterns and the dimensional stability required to prevent pattern melt during curing.
2Temperature
If photosensitive resin composition is heated for curing, then heat resistance is improved, but pattern shape and dimensions change due to pattern melt
Solution Approach 1:
The crosslinking agent performs preliminary crosslinking during the exposure and development stages, creating a stable network structure before heating. This preliminary action ensures that when heat is applied for curing, the pattern maintains its shape and dimensions while achieving heat resistance.
Solution Approach 2:
The patent changes the chemical parameters of the resin composition by adding the crosslinking agent, which alters the curing behavior. The crosslinking agent enables the system to achieve heat resistance through crosslinking rather than simple thermal hardening, thereby maintaining dimensional stability during the temperature increase.
3Ease of operation
If alkali-soluble resin with phenolic hydroxyl groups is used, then developability with aqueous alkali solution is improved, but residue generation during development occurs
Solution Approach 1:
The patent combines the alkali-soluble resin with a crosslinking agent that has specific solubility characteristics. This composite allows the exposed and developed portions to be easily removed by aqueous alkali solution while the crosslinked structure prevents excessive residue generation, achieving both good developability and clean development.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent developability with reduced residue, improved mechanical properties, and minimized pattern melt resistance, allowing for the formation of patterned cured films with high sensitivity and resolution, suitable for electronic components.
Implementation Method 1
a compound that generates an acid by light
Implementation Method 2
a step of curing the developed patterned resin film by heating
Data Source
AI summary
The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.