Photosensitive Resin Composition for Pattern Profile Control

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Solution Overview

Problem

Photosensitive resin compositions with high sensitivity face challenges in controlling pattern shape due to narrow optimal exposure dose ranges and low handleability, making it difficult to achieve desired pattern profiles.

Innovation Solution

A photosensitive resin composition combining a high-sensitivity photosensitive agent with a standard-sensitivity photosensitive agent, specifically formulated with polyimide precursors and selected compounds, to expand the exposure dose range and improve handleability, allowing for easier control of pattern profiles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a high-sensitivity photosensitive agent is used, then sensitivity is improved, but handleability deteriorates due to narrow optimal exposure dose range

Engineering Contradiction:
ImprovesensitivityVSAvoidhandleability
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The patent combines a high-sensitivity photosensitive agent (compound of formula 1) with a standard-sensitivity photosensitive agent (compound of formula 2) in specific proportions (0.01-5 mass% high-sensitivity agent and 95-95 mass% standard-sensitivity agent). This merging allows the composition to benefit from the high sensitivity of the first compound while the second compound provides a broader exposure dose range, thereby improving handleability without sacrificing sensitivity.

Inventive Principle:
Principle #5Merging (Combining)

2Measurement precision

If a high-sensitivity photosensitive agent is used, then sensitivity is improved, but pattern shape control deteriorates

Engineering Contradiction:
ImprovesensitivityVSAvoidpattern shape control
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

By merging a high-sensitivity photosensitive agent (formula 1) with a standard-sensitivity photosensitive agent (formula 2) in controlled proportions, the patent achieves both high sensitivity and good pattern shape control. The standard-sensitivity agent contributes to stable pattern formation and profile control, while the high-sensitivity agent maintains high sensitivity. The specific composition ratio ensures that neither agent dominates, allowing balanced performance in both sensitivity and pattern control.

Inventive Principle:
Principle #5Merging (Combining)

3Measurement precision

If the addition amount of high-sensitivity photosensitive agent is increased, then sensitivity is improved, but pattern profile control deteriorates due to large changes in pattern profile

Engineering Contradiction:
ImprovesensitivityVSAvoidpattern profile
Core Design Contradiction:
Measurement precisionVSShape

Solution Approach 1:

The patent optimizes the concentration parameter of the high-sensitivity photosensitive agent (formula 1) to be 0.01-5 mass% in the composition. At this controlled concentration range, the high-sensitivity agent provides sufficient sensitivity enhancement without causing excessive pattern profile changes. The standard-sensitivity agent (formula 2) acts as a buffer that stabilizes the pattern profile, preventing large variations even when the high-sensitivity agent is present.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The combined photosensitive resin composition enhances handleability and allows for gradual changes in pattern profiles with varying agent amounts, achieving desired profiles and expanding the exposure dose range, thereby improving the manufacturing process efficiency.

Implementation Method 1

a photosensitive resin composition comprising the following component (a), component (b1), and component (b2)... obtaining a resin pattern by irradiating the coating film with an active light...

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS11226560B2Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
Publication Date: 2022.01.18 HD MICROSYSTEMS LTD
  • US11226560B2 patent drawing
  • US11226560B2 patent drawing
  • US11226560B2 patent drawing

AI summary

A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).