Photosensitive Resin Composition for High-Resolution Semiconductor Patterns
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Solution Overview
Problem
Existing photosensitive resin compositions face challenges in achieving high resolution and pattern formation for semiconductor devices, particularly in forming re-distribution lines and insulating films, due to issues with film thickness, surface roughness, and shrinkage during curing.
Innovation Solution
A photosensitive resin composition comprising a resin with a specific repeating unit and a photosensitizing agent, applied thinly to form patterns with minimal surface roughness and shrinkage, using a combination of polyimide or polyimide precursor, and a naphthoquinone diazide compound, with controlled film thickness and heating to achieve excellent resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a photosensitive resin composition is applied to form thin films for high-resolution patterns, then the resolution is improved, but the film thickness control and surface flatness become more difficult to maintain
Solution Approach 1:
The patent modifies the chemical structure of the resin by introducing specific repeating units with formulas (1-1) and (1-2) containing polymerizable groups and imide structures. This structural parameter change enables the resin to form films with both high resolution and maintained surface flatness, resolving the contradiction between pattern resolution and surface flatness in thin film applications
Solution Approach 2:
The patent creates a composite resin system combining polyimide or polyimide precursor with specific repeating units and polymerizable groups. This composite material approach allows the resin to achieve both the thin film formation capability for high resolution and the structural stability for surface flatness, simultaneously addressing both requirements
2Reliability
If the resin composition is cured to form insulating films and re-distribution lines, then the functional performance is improved, but shrinkage and deformation during curing increase
Solution Approach 1:
The patent introduces specific repeating units with imide structures and polymerizable groups at controlled proportions (0.1-5.0 mmol/g for imide structures, 0.01-5.0 mmol/g for polymerizable groups). This local structural quality control allows the resin to cure with minimal shrinkage and deformation while maintaining functional performance, resolving the contradiction between reliability and shape stability during curing
Solution Approach 2:
The patent carefully controls the molecular weight (5,000-25,000) and compositional parameters of the resin to optimize curing behavior. These parameter changes enable the resin to achieve complete curing for functional performance while minimizing shrinkage and deformation, simultaneously improving reliability and shape stability
3Productivity
If conventional photosensitive resin compositions are used for re-distribution wiring, then the manufacturing adaptability is maintained, but the signal speed and miniaturization requirements cannot be met
Solution Approach 1:
The patent fundamentally changes the resin parameters by introducing specific repeating units with imide structures and polymerizable groups, achieving pattern formation capability with excellent resolution required for miniaturized re-distribution wiring and high-speed signal transmission, while maintaining manufacturing adaptability through standard coating and curing processes
Solution Approach 2:
The patent creates a resin composition that serves multiple functions: it provides high-resolution pattern formation for miniaturized wiring, maintains manufacturing adaptability through conventional application methods, and delivers the performance required for high-speed signals. This multi-functional resin resolves the contradiction between productivity and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of precise patterns with reduced flatness and shrinkage, enhancing the resolution and stability of semiconductor devices, particularly in interlayer insulating films for re-distribution layers.
Implementation Method 1
a photosensitive resin composition comprising a resin having a repeating unit represented by Formula (1-1); and a photosensitizing agent
Implementation Method 2
a cured substance obtained by curing the composition
Data Source
AI summary
A photosensitive resin composition including a resin having a repeating unit represented by Formula (1-1) and a photosensitizing agent, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for the cured substance, and a semiconductor device including the cured substance.In Formula (1-1), X1 represents an organic group including a structure obtained by removing two or more hydrogen atoms from a specific structure, Y1 represents an organic group including a structure obtained by removing two or more hydrogen atoms from a specific structure, R1's each independently represent an organic group having a polymerizable group, m represents an integer of 0 to 4, and n represents an integer of 1 or more.