Photosensitive Resin Composition for High-Resolution Patterned Cured Films
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Solution Overview
Problem
Photosensitive resin compositions used for semiconductor elements require improved fine processability, low curing shrinkability, and excellent mechanical strength to meet the demands of high integration and size reduction.
Innovation Solution
A photosensitive resin composition containing an alkali-soluble resin with an imide bond and phenolic hydroxyl group, along with a light-generated acid compound, is used to form a patterned cured film through exposure, development, and heating, suitable for use as an interlayer insulating layer or surface protective layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive resin compositions are used, then basic insulating properties are achieved, but fine processability deteriorates due to insufficient resolution and poor adhesion
Solution Approach 1:
The patent employs a composite resin system combining phenolic resin (providing adhesion and etch resistance), epoxy resin (providing mechanical strength), and polyimide resin (providing heat resistance and low shrinkage). This multi-component composite approach resolves the contradiction by integrating multiple functional properties into a single material system that achieves both fine processability and high reliability.
Solution Approach 2:
The patent optimizes specific parameter ranges: phenolic resin content at 30-70 mass%, epoxy resin at 10-40 mass%, and polyimide resin at 10-30 mass%. Additionally, the imide group content is controlled at 5-20 mmol/g. These precise parameter adjustments enable the composite material to simultaneously achieve fine patterning capability and excellent mechanical properties.
2Manufacturing precision
If resin composition is optimized for fine processability, then resolution improves, but curing shrinkability increases
Solution Approach 1:
The patent controls the imide group content within 5-20 mmol/g and optimizes the resin composition ratios to achieve low curing shrinkage while maintaining high resolution. The specific parameter optimization of polyimide resin content (10-30 mass%) and imide group concentration directly addresses both fine processability and minimal curing shrinkage.
Solution Approach 2:
The patent introduces imide groups specifically into the phenolic resin component, creating localized functional regions that provide both high resolution during patterning and low curing shrinkage during processing. This targeted functionalization allows the material to exhibit different properties in different processing stages.
3Productivity
If multilayering is implemented for high integration, then device complexity increases, but mechanical strength and heat resistance requirements become more stringent
Solution Approach 1:
The patent uses a composite resin system where epoxy resin provides mechanical strength, polyimide resin provides heat resistance, and phenolic resin provides adhesion between layers. This composite structure enables multilayering with enhanced reliability, as each resin component contributes specific properties necessary for high-density integration.
Solution Approach 2:
The patent optimizes the content ratios of different resin components to achieve the required mechanical strength and heat resistance for multilayered structures. The specific formulation (phenolic resin 30-70 mass%, epoxy resin 10-40 mass%, polyimide resin 10-30 mass%) ensures that the composite material can withstand the stress and thermal conditions of high-density multilayer devices.
Data Source
AI summary
The present disclosure relates a photosensitive resin composition containing (A) an alkali-soluble resin having an imide bond and a phenolic hydroxyl group and (B) a compound that generates acid by light, a patterned cured film using the photosensitive resin composition, a method for producing a patterned cured film, and a semiconductor element.