Photosensitive Resin Composition for Accurate PCB Resist Line Widths
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Solution Overview
Problem
Existing photosensitive resin compositions used in forming resist patterns for printed circuit boards often result in resist line widths that deviate from the designed value, necessitating corrections in the exposure process.
Innovation Solution
A photosensitive resin composition containing a binder polymer, a photopolymerizable compound with ethylenically unsaturated bonds, and an oxime ester-based photopolymerization initiator, with a specific content of the initiator at 0.3 parts by mass or more, is used to form resist patterns, ensuring accurate line widths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photosensitive resin compositions are used, then the exposure process can be completed, but the resist line width deviates from the designed value
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive resin composition by incorporating specific binder polymers with carboxyl groups and oxime ester-based photopolymerization initiators in controlled amounts. This chemical parameter modification enables the resin to achieve accurate resist line widths that match the designed values during exposure and development processes.
Solution Approach 2:
The patent creates a composite photosensitive resin system by combining multiple components: binder polymers containing carboxyl groups, oxime ester-based photopolymerization initiators, and other auxiliary components. This composite material approach allows the system to achieve precise resist pattern formation with accurate line widths that conventional single-component systems cannot achieve.
2Productivity
If resist pattern formation is performed with conventional compositions, then the pattern can be formed, but corrections in the exposure process are necessary
Solution Approach 1:
The patent incorporates specific binder polymers and photopolymerization initiators in predetermined ratios and amounts into the photosensitive resin composition before the exposure process. This preliminary preparation ensures that the resist pattern forms with accurate line widths directly during exposure, eliminating the need for subsequent corrective actions and reducing process time.
3Manufacturing precision
If photosensitive resin layer is laminated on substrate, then the layer can be attached, but positioning accuracy of the opening portion is affected
Solution Approach 1:
The patent modifies the chemical composition parameters of the photosensitive resin layer to achieve optimal adhesion properties. By controlling the types and amounts of binder polymers and other components, the resin layer achieves reliable attachment to the substrate while maintaining high positioning accuracy of the opening portions during the lamination process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition reduces deviations in resist line widths, allowing for efficient exposure processes without the need for significant corrections, thereby improving the precision of resist pattern formation.
Implementation Method 1
a photopolymerization initiator (C), in which the photopolymerization initiator (C) includes an oxime ester-based photopolymerization initiator
Data Source
AI summary
A photosensitive resin composition, containing: a binder polymer (A); a photopolymerizable compound (B) having at least one ethylenically unsaturated bond; and a photopolymerization initiator (C), in which the photopolymerization initiator (C) includes an oxime ester-based photopolymerization initiator, and a content of the oxime ester-based photopolymerization initiator is 0.3 parts by mass or more, with respect to a total of 100 parts by mass of the binder polymer (A) and the photopolymerizable compound (B).