Photosensitive Resin Composition for Copper and Nickel Plating Resist
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Solution Overview
Problem
Resists used for manufacturing copper column solder bumps need to be compatible with both copper and nickel plating processes, while maintaining resolution and preventing swelling or cracking.
Innovation Solution
A photosensitive resin composition comprising specific structural units and a photoacid generator, applied as a resist pattern, which includes a polymer with acid dissociable groups and a hydroxyaryl group, allowing for improved glass transition temperature and dissolution rate, enabling compatibility with both copper and nickel plating without swelling or cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a resist is used for both copper plating and nickel plating, then versatility is improved, but the resist may swell or crack during plating processes
Solution Approach 1:
The patent modifies the chemical composition parameters of the resist by incorporating specific structural units (a1), (a2), and (a3) with controlled ratios. Unit (a3) containing hydroxyaryl groups provides crosslinking capability that prevents swelling, while units (a1) and (a2) ensure solubility and pattern formation. The balanced composition enables the resist to withstand both copper and nickel plating solutions without swelling or cracking.
Solution Approach 2:
The resist composition is designed as a composite polymer system combining multiple structural units with different functions. Unit (a1) provides base polymer structure, unit (a2) enhances solubility and pattern definition, and unit (a3) provides crosslinking for swelling resistance. This composite structure allows the single resist to perform reliably in both copper and nickel plating applications.
2Reliability
If the resist pattern is made more resistant to plating solutions, then swelling and cracking are prevented, but the resolution may deteriorate
Solution Approach 1:
The patent applies local quality by giving different structural units different functions within the same polymer. Unit (a3) with hydroxyaryl groups is specifically designed for crosslinking to provide swelling resistance where needed, while units (a1) and (a2) maintain the polymer's ability to form fine patterns. The spatial distribution and ratio control of these units allow simultaneous achievement of resolution and swelling resistance.
Solution Approach 2:
The patent optimizes the ratio parameters of structural units to balance resolution and swelling resistance. By controlling the content of unit (a3) at 5-70 mol% and units (a1)+(a2) at 5-60 mol%, the resist achieves sufficient crosslinking for swelling resistance while maintaining adequate solubility and pattern definition capability for high resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The photosensitive resin composition achieves excellent resolution and prevents swelling or cracking during copper or nickel plating, ensuring the formation of reliable resist patterns for solder bumps.
Implementation Method 1
a photoacid generator (B)
Implementation Method 2
a polymer (A) having a structural unit (a1) represented by the following formula (a1), a structural unit (a2) represented by the following formula (a2), and a structural unit (a3) represented by the following formula (a3)... R13 and R23 each independently represent an acid dissociable group
Data Source
AI summary
The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.