Positive Photosensitive Resin Composition for Fine Patterns
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Solution Overview
Problem
Current positive photosensitive resin compositions for semiconductor devices face challenges in achieving high resolution and maintaining excellent mechanical characteristics and adhesiveness to substrates, especially when cured at low temperatures, and they often suffer from limitations in miniaturization and pattern complexity.
Innovation Solution
A positive photosensitive resin composition comprising an alkali-soluble resin with polyimide, polyamide, polybenzoxazole, or polyamide-imide structures, combined with a crosslinkable polymer compound and a quinonediazide photosensitizer, which increases alkaline aqueous solution solubility and allows for fine pattern formation and high resolution, while maintaining mechanical strength and adhesiveness even at low temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a positive photosensitive resin composition uses an alkali-soluble and closed-ring polyimide, quinonediazide compound, and heat crosslinking agent having a methylol group, then resolution is excellent, but breaking elongation value deteriorates when cured at low temperatures
Solution Approach 1:
The patent introduces a new parameter - the structural unit with formula (1) containing flexible chains - into the polyimide resin system. This structural modification changes the molecular flexibility parameter, allowing the resin to maintain breaking elongation ≥5% even when cured at low temperatures (220°C or lower), while preserving the excellent resolution achieved through alkali-soluble formulation and quinonediazide photolysis mechanism
Solution Approach 2:
The patent creates a composite resin system by combining alkali-soluble polyimide base resin with specific crosslinking agents ( compounds with formula (1) ). This composite structure integrates the high resolution capability of alkali-soluble systems with the mechanical flexibility provided by the crosslinkable structural units, achieving both excellent resolution and adequate breaking elongation at low curing temperatures
2Temperature
If photosensitive polyimide material is used for surface protective films and interlayer insulation films, then heat resistance to 300°C or higher is achieved, but low temperature curing at 220°C or lower results in insufficient mechanical characteristics
Solution Approach 1:
The patent modifies the curing temperature parameter by introducing crosslinkable structural units (formula (1)) that enable effective crosslinking at low temperatures (220°C or lower). The flexible chains in these structural units facilitate low-temperature crosslinking reactions, achieving adequate mechanical characteristics without requiring high-temperature curing that would compromise the mold material in FO-PLP processes
Solution Approach 2:
The patent applies local quality modification by incorporating specific structural units (formula (1)) with flexible chains into the polyimide resin system. These localized flexible segments enable low-temperature crosslinking in specific regions of the material, allowing the bulk material to maintain heat resistance while the crosslinked regions provide adequate mechanical characteristics at low curing temperatures
3Productivity
If miniaturization and higher performance of electronic devices advance, then demand for further miniaturization and higher density increases, but maintaining excellent electric characteristics, heat resistance, and mechanical characteristics becomes more difficult
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: the alkali-soluble formulation enables fine pattern formation for miniaturization, while the crosslinkable structural units (formula (1)) with flexible chains maintain mechanical characteristics and heat resistance. The combination achieves breaking elongation ≥5% and adequate tensile strength even when cured at low temperatures, supporting high-density interlayer insulation and surface protective film applications
Solution Approach 2:
The patent employs a composite resin system integrating alkali-soluble polyimide base resin with crosslinkable structural units (formula (1)). This composite material simultaneously provides the fine resolution needed for miniaturization and the mechanical/thermal properties required for reliable high-density electronic devices, resolving the contradiction between miniaturization and performance maintenance
Data Source
AI summary
A positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution, the resin composition and a positive photosensitive dry film derived therefrom that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.