Photosensitive Resin Composition for Low-Temperature Curing
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Solution Overview
Problem
The challenge is to develop a photosensitive resin composition that can form a cured film with high reliability, suitable for electronic devices, while being cured at a relatively low temperature of approximately 170° C. to minimize thermal damage to semiconductor chips.
Innovation Solution
A photosensitive resin composition containing a polyamide resin and/or a polyimide resin, where the cured film obtained by heating at 170° C. for 2 hours exhibits a storage elastic modulus E′220 of 0.5 to 3.0 GPa under specific dynamic viscoelasticity measurement conditions. This composition is used in a manufacturing method involving film formation, exposure, and development to create an electronic device with a reliable cured film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the photosensitive resin composition is cured at high temperature to ensure structural integrity and reliability, then the reliability is improved, but thermal damage to semiconductor chips occurs
Solution Approach 1:
The patent changes the curing temperature parameter from conventional high temperatures (200-400°C) to a lower temperature range (170°C for 2 hours). This parameter change enables the cured film to achieve sufficient structural integrity and reliability (storage elastic modulus E′220 of 0.5 to 3.0 GPa) without causing thermal damage to temperature-sensitive semiconductor chips, thus resolving the contradiction between reliability and thermal damage
2Object-affected harmful factors
If the photosensitive resin composition is cured at low temperature to prevent thermal damage, then thermal damage is reduced, but the structural integrity and reliability of the cured film deteriorate
Solution Approach 1:
The patent uses a composite resin composition containing both polyamide resin and polyimide resin in specific proportions (polyamide resin: 5-50 mass%, polyimide resin: 50-95 mass%). This composite material formulation enables the cured film to maintain high structural integrity and reliability (storage elastic modulus E′220 of 0.5 to 3.0 GPa) even when cured at low temperature (170°C), thus preventing thermal damage while ensuring reliability
3Ease of manufacture
If conventional photosensitive resin compositions are used, then manufacturing process is simple, but the cured film cannot maintain structural integrity at low curing temperatures
Solution Approach 1:
The patent employs a composite resin system combining polyamide resin and polyimide resin in specific ratios. This composite formulation enables the cured film to achieve adequate structural integrity (storage elastic modulus E′220 of 0.5 to 3.0 GPa) at low curing temperature (170°C) without complicating the manufacturing process, as the composition can be processed using conventional photo-curing equipment and procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enables the manufacture of electronic devices with high reliability by forming a cured film that maintains structural integrity even at elevated temperatures, thus reducing the risk of peeling and enhancing the overall reliability of the electronic device.
Implementation Method 1
the photoinitiator is a radical generator which generates radicals by photolysis
Implementation Method 2
the radical generator initiates polymerization
Implementation Method 3
a cured film obtained by heating the photosensitive resin composition at 170° C. for 2 hours
Data Source
AI summary
Provided is a photosensitive resin composition containing a polyamide resin and/or a polyimide resin, in which, in a case where a cured film obtained by heating the photosensitive resin composition at 170° C. for 2 hours is subjected to a dynamic viscoelasticity measurement under the following conditions, a storage elastic modulus E′220 at 220° C. is 0.5 to 3.0 GPa. [Conditions] Frequency: 1 Hz, Temperature: 30° C. to 300° C., heating rate: 5° C./min, Measurement mode: tensile mode