Photosensitive Resin Composition for Semiconductor Package Protective Film
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Solution Overview
Problem
Alkali-developing photosensitive resin compositions used in printed wiring boards for semiconductor packages exhibit poor durability in terms of chemical resistance, water resistance, heat resistance, and resistance to moist heat, leading to decreased adhesion between underfill material and cured film during prolonged PCT resistance testing.
Innovation Solution
A photosensitive resin composition comprising an acid-modified vinyl group-containing epoxy resin, a phenol compound, a compound with ethylenically unsaturated groups, a photopolymerization initiator, and inorganic fine particles, which forms a cured film with excellent adhesion and soldering heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If alkali-developing photosensitive resin composition is used to enable development by weak alkaline aqueous solutions, then working environment conservation and global environmental conservation are improved, but chemical resistance, water resistance, heat resistance and resistance to moist heat deteriorate
Solution Approach 1:
The patent uses a composite resin composition combining alkali-soluble resin (for environmental friendliness and alkali developability) with thermosetting resin components (for durability). The composition includes epoxy resin, phenolic resin, and cyanate resin that form a crosslinked network structure, creating a material that exhibits both alkali developability and high durability including chemical resistance, water resistance, heat resistance, and PCT resistance.
Solution Approach 2:
The patent modifies the chemical composition parameters by incorporating specific ratios of alkali-soluble resin (30-70 mass%) with thermosetting resins. The glass transition temperature is controlled to be 80-150°C, and the composition includes specific functional groups that enable both alkali development and high heat resistance, changing the material parameters to achieve dual functionality.
2Ease of operation
If alkali-developing photosensitive resin composition is used, then ease of operation is improved, but adhesion between underfill material and cured film deteriorates during prolonged PCT resistance testing
Solution Approach 1:
The patent creates a composite system where the cured film contains thermosetting resin components (epoxy, phenolic, cyanate resins) that form a crosslinked network structure. This composite structure provides both alkali developability (from the alkali-soluble resin component) and high adhesion to underfill material (from the thermosetting crosslinked network), preventing adhesion deterioration during PCT testing.
Solution Approach 2:
The patent creates different functional zones within the cured film: the alkali-soluble resin component provides alkali developability in the uncured state, while the thermosetting resin components (epoxy, phenolic, cyanate) form a crosslinked network that provides localized adhesion regions. This local differentiation of material properties enables both easy alkali development and maintained adhesion during PCT testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent adhesion between underfill material and cured film even after prolonged PCT resistance testing, along with improved soldering heat resistance, making it suitable for semiconductor package applications.
Implementation Method 1
a photopolymerization initiator
Data Source
AI summary
The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.