Photosensitive Resin Composition for High-Resolution Semiconductor Patterning
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Solution Overview
Problem
Existing wafer and panel level packaging methods in semiconductor devices face issues such as warpage due to thermal expansion rate differences, low filler content in liquid resins, and reliability problems, along with challenges in controlling pattern formation and achieving high resolution using highly sensitive photoinitiators.
Innovation Solution
A photosensitive resin composition comprising a polyimide or polybenzoxazole precursor, a photopolymerizable compound, a photoinitiator with a specific structure, and a solvent, which allows for precise pattern control and high resolution, while improving heat resistance and developability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive polyimide resin composition is used to simplify pattern forming process, then ease of manufacture is improved, but anti-corrosion and chemical resistance deteriorate
Solution Approach 1:
The patent uses a composite material system combining polyimide resin (for heat resistance and mechanical properties) with acrylic resin containing carboxyl groups (for chemical resistance and pattern formation). This composite approach allows the cured layer to achieve both ease of manufacture through photosensitivity and reliability through enhanced anti-corrosion and chemical resistance properties.
2Manufacturing precision
If highly sensitive photoinitiator is used to achieve high resolution, then manufacturing precision is improved, but pattern shape control becomes difficult
Solution Approach 1:
The patent changes the chemical parameters of the photoinitiator system by selecting specific compounds (2,4,6,8-tetramethyl-2,4,6,8-tetranitro-4a,8a-sultone and/or 2,4,6,8-tetramethyl-2,4,6,8-tetranitro-4a,8a-sultone derivatives) with controlled sensitivity. This parameter optimization enables high resolution pattern formation while maintaining adequate pattern shape control during development.
3Volume of moving object
If wafer level packaging is used to reduce semiconductor-mounting space, then volume is reduced, but warpage increases due to thermal expansion rate difference
Solution Approach 1:
The patent addresses thermal expansion mismatch by formulating the resin composition with polyimide resin as the base, which has thermal expansion properties compatible with semiconductor wafers. This reduces warpage during the heating and cooling cycles of wafer level packaging while maintaining the space-saving benefits of the packaging method.
4Ease of operation
If liquid epoxy resin or silicone resin is used as sealant, then ease of operation is improved, but inorganic filler content is low and reliability is reduced
Solution Approach 1:
The patent creates a composite resin composition incorporating inorganic fillers (such as silica, alumina, or boehmite) into the polyimide and acrylic resin matrix. This composite structure provides both the ease of operation associated with liquid resins and the enhanced reliability, mechanical strength, and thermal stability provided by high inorganic filler content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables easy handling, precise pattern formation, and high-resolution capabilities, reducing warpage and enhancing the reliability of semiconductor devices by controlling pattern shapes and ensuring consistent photo-curability across the resin film.
Implementation Method 1
a photopolymerizable compound and a photoinitiator, wherein the photoinitiator is represented by Chemical Formula 1
Data Source
AI summary
A photosensitive resin composition, a photosensitive resin layer manufactured utilizing the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes: (A) at least one resin selected from among a polyimide precursor and a polybenzoxazole precursor; (B) a photopolymerizable compound; (C) a photoinitiator represented by Chemical Formula 1; and (D) a solvent.