Photosensitive Resin Composition for Semiconductor Substrates
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Solution Overview
Problem
Conventional resin materials for semiconductor devices and organic electroluminescent elements face issues with high film shrinkage leading to stress and warpage, inadequate adhesion to metals, and insufficient extensibility, particularly when used in multi-layered structures with increased thickness.
Innovation Solution
A photosensitive resin composition comprising a polyamide structure with a diamine residue having an aliphatic group, an imide precursor structure, and an imide structure, which enhances adhesion to metals and reduces stress through improved interaction and flexibility, allowing for high extensibility and reduced film shrinkage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimide-based resins or polybenzoxazole-based resins are used, then heat resistance and electric insulation are improved, but large film shrinkage occurs after heat curing causing substrate warpage and stress
Solution Approach 1:
The invention changes the chemical structure parameters of the resin by incorporating flexible alkyl groups, alkylene glycol groups, and siloxane bonds into the repeating units of the polyimide and polybenzoxazole structures. These structural modifications reduce the film shrinkage rate upon heat curing while maintaining heat resistance, thereby preventing substrate warpage
Solution Approach 2:
The invention creates a composite resin structure combining polyimide and polybenzoxazole units with flexible groups integrated into the backbone. This composite approach allows the material to exhibit both high heat resistance and low shrinkage characteristics, resolving the contradiction between thermal stability and dimensional stability
2Stress or pressure
If flexible alkyl groups, alkylene glycol groups, and siloxane bonds are introduced into cyclized polyimide to reduce stress, then stress is reduced, but extensibility becomes insufficient leading to poor impact resistance
Solution Approach 1:
The invention optimizes the parameters of flexible groups by selecting specific types (alkyl, alkylene glycol, siloxane) and controlling their content within certain ranges. This balanced approach reduces film stress while maintaining sufficient extensibility for impact resistance
Solution Approach 2:
The invention introduces flexible groups at specific locations within the polymer chain (in the repeating units) rather than uniformly throughout. This localized modification allows stress reduction in specific regions while preserving overall structural integrity and extensibility
3Stress or pressure
If benzoxazole precursor with aliphatic group on dicarboxylic acid is used to reduce stress, then some stress reduction is achieved, but adhesion to metals remains insufficient due to lack of interaction sites
Solution Approach 1:
The invention introduces specific functional groups (carboxyl, hydroxyl, or amino groups) at localized positions within the polymer structure. These groups serve as metal interaction sites, providing adhesion to metals while the flexible groups elsewhere in the structure provide stress reduction
Solution Approach 2:
The invention creates a composite structure combining flexible stress-reducing groups with metal-adhesion-promoting functional groups within the same polymer chain. This multi-functional composite approach simultaneously achieves stress reduction and metal adhesion
4Use of energy by moving object
If benzoxazole and imide structure are copolymerized to enhance adhesion, then adhesion is improved in some cases, but stress reduction and extensibility remain insufficient
Solution Approach 1:
The invention changes the structural parameters by incorporating flexible aliphatic groups into the copolymerized benzoxazole-imide structure. This modification maintains adhesion properties while restoring extensibility and stress reduction capabilities
Solution Approach 2:
The invention creates a three-component composite structure combining benzoxazole units, imide units, and flexible aliphatic groups. This composite approach balances adhesion, stress reduction, and extensibility properties that were insufficient in previous copolymerization attempts
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves a cured film with high extensibility, reduced stress, and enhanced adhesion to metals, addressing the limitations of conventional materials by promoting flexible bonding and minimizing substrate warpage.
Implementation Method 1
enhanced adhesion to metals because it has no site to interact with a metal
Implementation Method 2
a method of reducing the stress generated during forming a cured film to achieve reduction in stress in which a flexible alkyl group, alkylene glycol group, and/or siloxane bond is introduced
Implementation Method 3
a method of reducing the stress generated during forming a cured film to achieve reduction in stress in which a flexible alkyl group, alkylene glycol group, and/or siloxane bond is introduced
Implementation Method 4
curing at a low temperature and reducing stress are required in order to reduce a heat load onto a semiconductor device in a production process
Data Source
Figure 1
Figure 2a~2f
Figure 3~4
AI summary
A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.