Photosensitive Resin Coating for Chemical-Resistant Thick Film Patterns
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Solution Overview
Problem
Existing photosensitive silicone compositions used for protecting semiconductor devices and circuit boards suffer from poor chemical resistance against photoresist strippers and cracking during thermal cycling, leading to unreliable coatings.
Innovation Solution
A photosensitive resin composition comprising a silicone resin with epoxy and/or phenolic hydroxy groups, an alkyl phenol novolak resin, and a photoacid generator, which forms a coating with improved adhesion and crack resistance, suitable for thick film patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive silicone composition is used to achieve low temperature curing and good moisture resistance, then the coating reliability is improved, but the chemical resistance against photoresist strippers deteriorates
Solution Approach 1:
The patent uses a composite material system consisting of silicone resin base polymer, phenolic resin crosslinking agent, and epoxy resin modifier. This composite structure combines the moisture resistance of silicone with the chemical resistance of phenolic and epoxy resins, achieving both reliability and chemical resistance simultaneously.
2Object-affected harmful factors
If a silphenylene structure-containing silicone polymer is used to improve chemical resistance, then the chemical resistance against photoresist strippers is improved, but the adhesion and crack resistance deteriorate
Solution Approach 1:
The patent modifies the chemical structure by introducing phenolic hydroxy groups and epoxy groups at specific concentrations (0.1-10 mmol/g for phenolic hydroxy, 0.05-5 mmol/g for epoxy groups). These parameter changes enable the resin to achieve both chemical resistance and good adhesion/crack resistance by optimizing the functional group content.
Solution Approach 2:
The patent creates a composite resin system combining silicone resin with phenolic resin and epoxy resin components. This composite structure provides chemical resistance from the phenolic/epoxy crosslinked network while maintaining adhesion and crack resistance through the silicone backbone and optimized composition ratios.
3Reliability
If a thick film coating is applied to ensure adequate protection, then the protective coverage is improved, but the ability to form fine size patterns deteriorates
Solution Approach 1:
The patent optimizes the viscosity and curing characteristics of the photosensitive resin composition to enable thick film coating (10-100 μm) while maintaining pattern formation capability. The specific composition ratios and functional group content control the film thickness and curing behavior, allowing fine patterns to be formed even in thick coatings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a coating with enhanced chemical resistance, adhesion, and mechanical properties, suitable for protecting electronic parts and forming reliable patterns on circuit boards and semiconductor devices.
Implementation Method 1
a photoacid generator
Implementation Method 2
silicone resin containing an epoxy group and/or phenolic hydroxy group
Data Source
AI summary
Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C).(In the formula, R51 is a C1-9 saturated hydrocarbyl group. R52 is a C10-25 saturated hydrocarbyl group. n1 and n2 are numbers that fulfil 0≤n1<1, 0<n2≤1, and n1+n2=1. m1 represents an integer from 0 to 3 and m2 represents an integer from 1 to 3.)