Photosensitive Resin Composition for Thick High-Aspect Resist Patterns
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Solution Overview
Problem
Conventional photosensitive resin compositions struggle to form resist patterns with high aspect ratios and thick films due to light penetration issues, adhesiveness problems, and prolonged developing and peeling times, necessitating a composition with improved developability and releasability.
Innovation Solution
A photosensitive resin composition comprising a binder polymer with a structural unit derived from acrylic acid, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer in specific mass ratios, allowing for the formation of a photosensitive element with a thickness of 30 µm or more and enabling the formation of resist patterns with high aspect ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the photosensitive layer is increased to form thick film resist patterns, then the film thickness is improved, but light penetration to the bottom part deteriorates and adhesiveness is reduced
Solution Approach 1:
The patent changes the chemical composition parameters of the photosensitive resin by incorporating specific acrylic acid structural units in controlled amounts (0.1-10 mass%) and using low sensitizer content (less than 0.01 parts by mass relative to binder polymer and photopolymerizable compound). This compositional parameter change enables thick film formation while maintaining adequate light penetration and adhesiveness through optimized molecular structure and reduced light-absorbing impurities.
2Volume of moving object
If the thickness of the photosensitive layer is increased to form thick film resist patterns, then the film thickness is improved, but the developing time and releasing time become longer
Solution Approach 1:
The patent optimizes chemical composition parameters including acrylic acid content (0.1-10 mass%) and sensitizer content (less than 0.01 parts by mass relative to binder polymer and photopolymerizable compound). These parameter changes create a resin system with improved developability and releasability, enabling shorter processing times even for thick films through enhanced chemical reactivity and reduced adhesion to substrates.
Solution Approach 2:
The patent introduces specific binder polymers containing acrylic acid structural units as intermediary components that facilitate both thick film formation and rapid processing. These binder polymers act as mediators between the photopolymerizable compounds and the substrate, providing controlled adhesion during processing while enabling efficient development and release.
3Volume of moving object
If the thickness of the photosensitive layer is increased to form thick film resist patterns, then the film thickness is improved, but the aspect ratio capability deteriorates
Solution Approach 1:
The patent employs precise parameter control of the photosensitive resin composition, specifically setting acrylic acid structural unit content at 0.1-10 mass% and sensitizer content at less than 0.01 parts by mass relative to the combined weight of binder polymer and photopolymerizable compound. These parameter optimizations enable the formation of resist patterns with high aspect ratios by ensuring uniform curing throughout thick films and maintaining pattern fidelity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent developability and releasability, facilitating the formation of resist patterns with high aspect ratios and improving production efficiency by shortening developing and peeling times.
Implementation Method 1
irradiating at least a portion of the photosensitive layer with active light rays to form a photocured part
Data Source
Figure 1
AI summary
A photosensitive resin composition according to an aspect of the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a structural unit derived from acrylic acid, and a content of the sensitizer is less than 0.01 parts by mass with respect to 100 parts by mass of a total amount of the binder polymer and the photopolymerizable compound.