Photosensitive Resin Composition Viscosity Control for High-Resolution Patterning
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Solution Overview
Problem
Conventional photosensitive resin compositions face challenges in achieving high-resolution patterning at low light intensity and maintaining excellent pattern adhesion and cured film properties, particularly due to high viscosity issues and the difficulty in handling black matrix compositions with poor light-shielding properties, which affect the coating process and film strength.
Innovation Solution
A photosensitive resin composition comprising a polyamic ester compound represented by Formula 1, which includes specific functional groups and molecular weight ranges, along with a polymeric binder, photocrosslinking agents, and photoinitiators, to enhance resolution, adhesion, and cured film properties, allowing for high-resolution patterning and improved process characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the viscosity of the photosensitive resin composition is reduced to improve coating uniformity, then the film thickness uniformity is improved, but the pattern adhesion and cured film properties deteriorate
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity of the photosensitive resin composition within a specific range (100 to 10,000 cP at 25°C). This optimized viscosity parameter enables the composition to achieve both good coating uniformity and adequate pattern adhesion, resolving the contradiction between flowability and bonding strength.
Solution Approach 2:
The patent uses composite materials by combining polyamic ester compounds with specific functional groups (carboxyl, hydroxyl, amino, or carboxylate groups) in a formulated resin composition. This composite approach allows the material to exhibit both low enough viscosity for uniform coating and high enough adhesion for reliable pattern bonding.
2Object-affected harmful factors
If black matrix compositions are used to improve light-shielding properties, then the light-shielding performance is improved, but the viscosity increases and handling becomes difficult
Solution Approach 1:
The patent applies parameter changes by formulating the resin composition with controlled viscosity (100 to 10,000 cP) that remains manageable even when black matrix compositions are incorporated. This viscosity control ensures the composition can be easily applied and processed while maintaining the required light-shielding properties.
3Manufacturing precision
If the photosensitive resin composition is applied by slit coating method to improve coating control, then the coating precision is improved, but the viscosity must be very low (<3.5 mPas) which conflicts with adhesion requirements
Solution Approach 1:
The patent resolves this contradiction by changing the viscosity parameter to an optimized range (100 to 10,000 cP) that is suitable for slit coating while maintaining adequate pattern adhesion. This revised viscosity parameter allows the composition to flow sufficiently for precise coating control without becoming too thin to maintain bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high-resolution patterning at low light intensity with excellent pattern adhesion and cured film properties, reducing the challenges of high viscosity and poor light-shielding issues, while maintaining compatibility with other materials.
Implementation Method 1
a photosensitive resin composition comprising a polyamic ester compound... along with a polymeric binder, photocrosslinking agents, and photoinitiators
Data Source
AI summary
The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.