Photosensitive Silicone Resin Composition for Crack-Resistant Protective Films
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Solution Overview
Problem
Existing photosensitive resin compositions for semiconductor devices and circuit boards face challenges with chemical resistance, particularly against photoresist strippers, and exhibit cracking issues during thermal cycling tests, limiting their reliability as protective films and bonding materials.
Innovation Solution
A photosensitive resin composition comprising a specific silicone resin, a filler such as silica or silicone powder, and a photoacid generator, which forms a coating with improved adhesion, crack resistance, and mechanical properties, suitable for forming fine patterns and bonding substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive silicone composition is used to achieve low temperature curing and flexibility, then moisture resistant adhesion is improved, but chemical resistance against photoresist strippers deteriorates
Solution Approach 1:
The patent employs a composite resin system combining silicone resin with epoxy resin and phenolic resin. The silicone resin provides low-temperature curing and flexibility, the epoxy resin contributes to adhesion and mechanical strength, and the phenolic resin enhances chemical resistance. This multi-component composite approach allows simultaneous achievement of moisture resistant adhesion and chemical resistance against photoresist strippers.
2Object-affected harmful factors
If a silphenylene structure-containing silicone polymer is used to improve chemical resistance, then resistance against photoresist strippers is improved, but thermal cycling reliability deteriorates with peeling and cracking
Solution Approach 1:
The patent combines silphenylene structure-containing silicone polymer with epoxy resin and phenolic resin to create a composite system. The silphenylene structure provides chemical resistance, while the epoxy and phenolic resins contribute to thermal stability and crack resistance. The synergistic interaction among these components maintains film integrity during thermal cycling while preserving chemical resistance.
Solution Approach 2:
The patent modifies the resin composition by incorporating specific ratios of epoxy resin (10-50 parts by weight per 100 parts silicone resin) and phenolic resin (5-30 parts by weight per 100 parts silicone resin). These parameter adjustments optimize the balance between chemical resistance and thermal cycling reliability, preventing peeling and cracking while maintaining resistance against photoresist strippers.
3Reliability
If resin composition is optimized for adhesion and chemical resistance, then film reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent establishes specific parameter ranges for resin components: 70-95 parts by weight silicone resin, 10-50 parts by weight epoxy resin, and 5-30 parts by weight phenolic resin per 100 parts silicone resin. These quantified parameters provide a clear formulation guideline that balances film reliability with manufacturing simplicity, eliminating the need for complex optimization processes while ensuring consistent performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of a reliable protective film with enhanced adhesion, mechanical strength, and thermal stability, suitable for electronic parts and circuit boards, while maintaining chemical resistance and allowing for precise pattern formation.
Implementation Method 1
a photoacid generator (C)
Data Source
AI summary
A photosensitive resin composition comprising (A) a silicone resin comprising recurring units having formula (al) and recurring units having formula (bl), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film.