Photosensitive Silicone Resin Low Temperature Curing
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Solution Overview
Problem
Existing photosensitive resin compositions for semiconductor devices and printed circuit boards face challenges in forming fine patterns and achieving high chemical resistance and copper migration resistance when cold-cured at 150°C or lower.
Innovation Solution
A photosensitive resin composition comprising a silicone resin with a silphenylene, polysiloxane, and fluorene structure at the main chain and acryloyl or methacryloyl groups at the side chain, combined with a photoradical generator, which enables the formation of fine patterns and high chemical resistance even at low curing temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a photosensitive silicone composition with a silphenylene structure is used, then flexibility and chemical resistance are improved, but fine pattern formation becomes difficult due to acid diffusion during PEB step
Solution Approach 1:
The patent changes the chemical parameters of the photosensitive composition by replacing the acid-catalyzed crosslinking system with a photoradical-based crosslinking system using (meth)acryloyl groups. This fundamental parameter change eliminates the need for thermal PEB step, preventing acid diffusion and enabling fine pattern formation while maintaining the chemical resistance provided by the silphenylene structure.
Solution Approach 2:
The patent extracts and removes the problematic PEB step from the processing sequence. By incorporating photoradical generators and (meth)acryloyl functional groups, the crosslinking reaction is transferred to occur during photoirradiation rather than requiring a separate thermal treatment step, thereby eliminating the source of acid diffusion that degrades pattern precision.
2Reliability
If post-curing is performed at 150°C or higher, then chemical resistance and copper migration resistance are improved, but thermal load on device increases
Solution Approach 1:
The patent substitutes the thermal curing mechanism with a photopolymerization mechanism. By using photoradical generators that activate (meth)acryloyl groups upon light irradiation, the crosslinking reaction proceeds at ambient or low temperatures without requiring high-temperature thermal treatment, thereby reducing thermal load on devices while achieving adequate chemical resistance.
3Temperature
If post-curing is performed at 150°C or lower, then thermal load on device is reduced, but chemical resistance and copper migration resistance significantly deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters by introducing (meth)acryloyl functional groups and photoradical generators, which enable crosslinking reactions to proceed effectively at lower temperatures. This compositional modification allows the formation of a densely crosslinked network structure even at 150°C or lower, achieving both low thermal load and high chemical resistance simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition allows for the formation of fine patterns and achieves high chemical resistance and copper migration resistance, even when cold-cured at 150°C or lower, making it suitable for protecting electrical and electronic parts.
Implementation Method 1
a photoradical generator... enables the formation of fine patterns and high chemical resistance even at low curing temperatures
Data Source
AI summary
A photosensitive resin composition includes: (A) a silicone resin that has a silphenylene structure, a polysiloxane structure, and a fluorene structure at a main chain and has an acryloyl group or a methacryloyl group at a side chain; and (B) a photoradical generator.