Photosensitive Siloxane Composition for Active Matrix Substrates
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Solution Overview
Problem
The existing positive type photosensitive siloxane compositions used in active matrix substrates for display apparatuses face challenges such as complex manufacturing processes, high costs, weak film strength, warping due to thermal expansion differences, cracking, peeling, and defects caused by impurities and by-products, leading to reduced yield and increased costs, as well as limited light transmittance.
Innovation Solution
A positive type photosensitive siloxane composition comprising at least two polysiloxanes with different dissolution rates in TMAH aqueous solutions, a diazonaphthoquinone derivative, and a photoacid generator, which forms a film with high heat resistance, low temperature curability, and high crack resistance, eliminating the need for resist application and etching processes, thereby simplifying the manufacturing process and improving yield while maintaining good light transmittance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a siloxane composition containing a silicon resin is used as an interlayer insulating film material, then the film strength is improved, but the manufacturing process becomes complex and costs increase due to resist application and etching processes
Solution Approach 1:
The patent combines the interlayer insulating film material with photosensitive properties by incorporating a photopolymerizable group-containing compound into the siloxane composition. This merging of insulation and photosensitivity functions allows the film to be patterned directly through photolithography without separate resist application and etching processes, thereby simplifying the manufacturing process while maintaining film strength.
Solution Approach 2:
The siloxane composition is designed to perform multiple functions simultaneously: it provides electrical insulation as an interlayer insulating film, exhibits photosensitivity for direct patterning, and maintains adequate film strength. This multi-functionality eliminates the need for separate resist and etching materials, reducing process complexity.
2Strength
If a siloxane composition with high film strength is used, then the film can resist mechanical stress, but warping occurs due to thermal expansion differences at low temperatures
Solution Approach 1:
The patent employs a composite siloxane composition containing multiple components including a silicon resin, a polysiloxane, and a photopolymerizable group-containing compound. This composite structure allows optimization of thermal expansion properties to match the substrate, reducing warping at low temperatures while maintaining film strength through the synergistic combination of materials.
3Manufacturing precision
If conventional etching processes are used to form opening parts, then precise patterns can be achieved, but manufacturing costs increase and yield decreases due to by-products and defects
Solution Approach 1:
The patent extracts and eliminates the harmful etching process from the manufacturing sequence by using a photosensitive siloxane composition that can be directly patterned through photolithography and development. This removes the source of by-products and defects associated with etching, improving yield while maintaining pattern precision through the photosensitive mechanism.
4Illumination intensity
If the interlayer insulating film is made thin to improve light transmittance, then display brightness is improved, but film strength decreases and cracking occurs
Solution Approach 1:
The patent changes the chemical composition parameters of the siloxane film by incorporating photopolymerizable groups and optimizing the ratio of silicon resin to polysiloxane. This allows the formation of ultra-thin films with enhanced mechanical strength through crosslinking upon photopolymerization, enabling thin films to maintain adequate strength while maximizing light transmittance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high heat resistance, low temperature curability, and high crack resistance, reducing manufacturing costs and defects, and enhancing the yield and light transmittance of the active matrix substrate, making it suitable for use in display apparatuses.
Implementation Method 1
a photoacid generator
Implementation Method 2
a siloxane oligomer and a void-forming material are uniformly dissolved
Implementation Method 3
a siloxane composition having a Si—O—C bond as a skeleton
Data Source
AI summary
The present invention provides a positive type photosensitive siloxane composition in which a film formed by the same has high heat resistance, high strength and high crack resistance, an active matrix substrate in which by-product is not generated, an occurrence of defects is suppressed, and an interlayer insulating film is easily formed at a low cost while having good transmittance, a display apparatus including the active matrix substrate, and a method of manufacturing the active matrix substrate. An active matrix substrate includes a plurality of gate wirings provided so as to extend parallel to each other on an insulating substrate, and a plurality of source wirings provided so as to extend parallel to each other in a direction intersecting the respective gate wirings. An interlayer insulating film and a gate insulating film are interposed at portions including the intersecting portions of the gate wirings and the source wirings, on a lower side of the source wiring. The interlayer insulating film is formed using the positive type photosensitive siloxane composition without using a resist.