Display Panel Integration of Photosensitive Elements With Fewer Photomasks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current display panel technologies face increased production costs due to the plug-in method of environmental light photosensitive elements, which requires multiple photomasks and complex processes.
Innovation Solution
A display panel and manufacturing method that integrates photosensitive elements with thin film transistor devices on the same side of the substrate, using fewer photomasks by sharing manufacturing steps, such as forming through holes and electrodes, to reduce thickness and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the plug-in method is used to integrate photosensitive elements into the display panel, then the photosensitive element can be added to the display panel, but the production cost increases and multiple photomasks are required
Solution Approach 1:
The patent merges the formation of the photosensitive element with the existing thin film transistor manufacturing process. Specifically, the photosensitive layer is formed simultaneously with the semiconductor layer of the TFT, and the electrode of the photosensitive element is integrated with the source/drain electrode structure. This merging eliminates the need for separate photomasks for the photosensitive element, as the same photomasks used for TFT patterning are reused for photosensitive element patterning.
Solution Approach 2:
The patent makes the existing TFT manufacturing process serve multiple functions: it simultaneously creates both the thin film transistor device and the photosensitive element. The semiconductor layer formation process serves dual purposes by creating both the TFT active channel and the photosensitive layer, while the electrode formation serves both TFT connection and photosensitive element electrode functions. This multi-functionality reduces the total number of photomasks required.
2Adaptability or versatility
If the plug-in method is used to integrate photosensitive elements, then the photosensitive element can be added, but the manufacturing cost increases
Solution Approach 1:
The patent combines the photosensitive element fabrication with the TFT fabrication into a single integrated process flow. By forming the photosensitive layer simultaneously with the TFT semiconductor layer and reusing the same photomasks and deposition processes, the manufacturing cost is reduced through process consolidation and elimination of redundant manufacturing steps.
Solution Approach 2:
The existing TFT manufacturing infrastructure and process steps serve the dual purpose of creating both the TFT device and the photosensitive element. The same deposition chambers, photomasks, and processing conditions are reused, allowing the system to serve itself rather than requiring separate dedicated processes for the photosensitive element.
3Reliability
If separate processes are used for TFT and photosensitive element fabrication, then each component can be optimized independently, but the overall device thickness increases
Solution Approach 1:
The patent nests the photosensitive element structure within the TFT structure. The photosensitive layer is formed within the same layer stack as the TFT semiconductor layer, and the photosensitive element electrode is integrated with the TFT source/drain electrode structure. This nesting approach allows both components to coexist in the same spatial envelope, avoiding additional thickness that would result from separate stacked structures.
Solution Approach 2:
The patent resolves the thickness conflict by utilizing the planar dimension and layer integration rather than adding vertical stacking. The photosensitive element is formed in the same plane and layer sequence as the TFT, using the available lateral space and existing vertical layer structure, thereby avoiding increase in the overall device thickness.
Data Source
AI summary
An embodiment of the present application discloses a display panel and a display panel manufacturing method. The photosensitive element and the thin film transistor device are disposed on the same side of the substrate. Some components of the photosensitive element and some components of the thin film transistor device can be manufactured by the same step, and therefore can improve integration of the photosensitive element on the array substrate. Furthermore, the photosensitive element can be integrated in the display panel with reduced photomasks and a lowered cost.