Photosensor Lateral Surface Encapsulation Reduces Leak Current

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Solution Overview

Problem

Conventional photosensors face issues such as increased lateral side leak current, dark current, and decreased photo response due to the etching process during semiconductor junction formation, and opaque electrodes that reduce the effective photo-sensing area.

Innovation Solution

A photosensor design featuring a semiconductor junction with a second polarity semiconductor layer that encapsulates the lateral surface, eliminating the need for an opaque electrode and reducing the impact of etching, comprising a base substrate, insulating layer, and a photodiode with a first and intrinsic semiconductor layer, and a second polarity semiconductor layer that encapsulates the lateral surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional etching process is used during semiconductor junction formation, then semiconductor junction can be formed, but lateral side leak current increases and photo response decreases

Engineering Contradiction:
Improvelateral side leak currentVSAvoidetching process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

An insulating layer is introduced as an intermediary between the semiconductor junction and the environment. This insulating layer covers the lateral surface of the semiconductor junction, preventing direct exposure to etchants and eliminating lateral side leak current without requiring etching of the junction structure itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts and eliminates the harmful etching process from the manufacturing sequence. By forming the semiconductor junction before applying the insulating layer, the need for subsequent etching is removed, thereby preventing lateral side leak current generation.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If opaque electrode is used to form semiconductor junction, then electrical connection is achieved, but effective photo-sensing area is reduced

Engineering Contradiction:
Improvephoto responseVSAvoideffective photo-sensing area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from using opaque electrodes to transparent conductive electrodes. This change in optical property (from opaque to transparent) allows light to pass through the electrode layer, maintaining electrical connectivity while preserving the effective photo-sensing area and enhancing photo response.

Inventive Principle:
Principle #32Color changes

Solution Approach 2:

The optical parameters of the electrode material are changed from opaque to transparent. By selecting transparent conductive materials and optimizing their thickness, the electrode maintains its electrical function while becoming optically transparent, thereby eliminating the trade-off between electrical connection and photo-sensing area.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design decreases lateral side leak current, dark current, and increases photo response, enhancing the effective photo-sensing area by avoiding the etching process's adverse effects and eliminating the need for opaque electrodes.

Implementation Method 1

a photodiode comprising a semiconductor junction on a side of the insulating layer away from the base substrate

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11251208B2Photosensor, display apparatus, and method of fabricating photosensor
Publication Date: 2022.02.15 BOE TECHNOLOGY GROUP CO LTD
  • US11251208B2 patent drawing
  • US11251208B2 patent drawing
  • US11251208B2 patent drawing

AI summary

A photosensor includes a base substrate; an insulating layer on the base substrate; and a photodiode including a semiconductor junction on a side of the insulating layer away from the base substrate. The semiconductor junction includes a first polarity semiconductor layer, an intrinsic semiconductor layer, and a second polarity semiconductor layer, stacked on the insulating layer. The second polarity semiconductor layer encapsulates a lateral surface of the intrinsic semiconductor layer.