Photosensor Resin Molding with Light Diffusing Agent
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Solution Overview
Problem
The existing photosensor molding process is complicated due to the need for separate resins with different light diffusing properties for the emitter, receiver, and operation indicator elements, which affects light detection and visibility.
Innovation Solution
A photosensor design where the emitter, receiver, and operation indicator elements are encapsulated with the same resin material containing a light diffusing agent, connected by a conductive leadframe, allowing for a single molding process and optimizing light transmittance between 20% and 60% to enhance visibility and detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the resin encapsulating the emitter element and receiver element contains a large amount of light diffusing agent, then the visibility of the operation indicator lamp is improved, but the amount of light reaching the receiver element is reduced
Solution Approach 1:
The patent divides the resin into two separate encapsulation portions: a first resin encapsulating the emitter and receiver elements, and a second resin encapsulating the luminous element. This segmentation allows each resin to have optimized light diffusing agent content for its specific function, resolving the contradiction between visibility and detection accuracy.
Solution Approach 2:
Different regions of the resin are given different properties: the first resin has lower light diffusing agent content (10-30% by weight) to maintain detection accuracy, while the second resin has higher light diffusing agent content to maximize visibility of the operation indicator lamp. This local quality differentiation resolves the contradiction.
2Illumination intensity
If the resin encapsulating the emitter element and receiver element contains a large amount of light diffusing agent, then the visibility of the operation indicator lamp is improved, but the detection is affected greatly by ambient light
Solution Approach 1:
The patent segments the resin into two distinct encapsulation materials with different light diffusing agent contents. The first resin protects the detection elements from ambient light interference, while the second resin enhances visibility, resolving the contradiction between visibility improvement and ambient light resistance.
Solution Approach 2:
The first resin is designed with controlled light diffusing properties to resist ambient light interference, while the second resin is designed with high light diffusing properties for visibility. This local quality assignment resolves the contradiction between visibility and ambient light resistance.
3Reliability
If separate resins are used for encapsulating the emitter-receiver elements and the luminous element, then the intended performance for each resin is achieved, but the molding process is complicated
Solution Approach 1:
While maintaining segmentation of resin functions, the patent integrates the molding process by using a common base resin material for both encapsulation portions. This allows separate performance optimization through controlled addition of light diffusing agents while simplifying the molding process through material uniformity.
Solution Approach 2:
The patent uses the same base resin material for both first and second encapsulation resins, making the resin material universal. Different light diffusing agent contents provide different functions, achieving performance optimization without complicating the molding process through material variety.
4Measurement precision
If no light diffusing agent is used in the resin encapsulating the emitter element and receiver element, then the detection accuracy is maintained, but the visibility of the operation indicator lamp is reduced
Solution Approach 1:
The patent segments the resin system into two parts: the first resin with controlled light diffusing agent content for detection accuracy, and the second resin with high light diffusing agent content for visibility. This segmentation allows both requirements to be satisfied simultaneously.
Solution Approach 2:
The first resin is designed with specific light diffusing properties for accurate detection, while the second resin is designed with high light diffusing properties for visibility. This local quality assignment resolves the contradiction between detection accuracy and visibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the molding process while maintaining the necessary light transmittance for effective light detection and visibility of the operation indicator, reducing the impact of ambient light on the detection system.
Implementation Method 1
the resin encapsulating the emitter element and a receiver element contains 10% to 30% by weight of light diffusing agent
Data Source
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AI summary
A photosensor simplifies the resin molding process for an emitter element (11), a receiver element (16), and a luminous element (42) forming an operation indicator lamp. The photosensor includes an emitter element (11), an emitter-encapsulating portion (12), a receiver element (16), a receiver-encapsulating portion (17), a circuit portion (40), and a circuit-encapsulating portion (90). The emitter-encapsulating portion (12) encapsulates the emitter element (11). The receiver-encapsulating portion (17) encapsulates the receiver element (16). The circuit portion (40) includes a luminous element (42) for indicating an operation. The circuit-encapsulating portion (90) encapsulates the circuit portion. The circuit-encapsulating portion includes an operation indicator (92) portion facing the luminous element. The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are connected to one another with a conductive leadframe (8). The emitter-encapsulating portion (12), the receiver-encapsulating portion (17), and the circuit-encapsulating portion (90) are formed from the same resin material containing a light diffusing agent.