Photosintering Composition for Uniform Conductive Film
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Solution Overview
Problem
The formation of a conductive film using cuprous oxide powder results in uneven films and low adhesion to substrates due to insufficient reduction and sintering during photoirradiation.
Innovation Solution
A photosintering composition comprising cuprous oxide particles with specific additive elements like tin, manganese, vanadium, cerium, iron, or silver, combined with a metal particle of low volume resistivity and a solvent, applied to a substrate and irradiated to form a uniform conductive film with good adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cuprous oxide powder is used for forming conductive film by photoirradiation, then low temperature sintering is achieved, but the coating film scatters and forms uneven conductive film with low adhesion
Solution Approach 1:
A binder resin is introduced as an intermediary substance between cuprous oxide particles and substrate. The binder resin holds particles together during photoirradiation, preventing scattering and maintaining film uniformity, while enabling low-temperature sintering to proceed effectively
Solution Approach 2:
The conductive paste is formulated as a composite material containing cuprous oxide particles, binder resin, and solvent in specific proportions. This composite structure ensures proper particle distribution, prevents film scattering during processing, and achieves both low temperature sintering and high film uniformity
2Temperature
If cuprous oxide powder is used for forming conductive film by photoirradiation, then low temperature sintering is achieved, but reduction to copper and sintering are insufficient resulting in low adhesion
Solution Approach 1:
The chemical composition parameters of the conductive paste are optimized by controlling cuprous oxide particle size (0.1-10 μm) and adjusting the binder resin-to-solvent ratio. These parameter changes enable sufficient reduction to copper and sintering at low temperatures while achieving strong adhesion to substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a low-resistant, uniform conductive film with improved adhesion to the substrate through controlled reduction and sintering during photoirradiation, overcoming the issues of film unevenness and low adhesion in existing methods.
Implementation Method 1
a step of irradiating the coating film with light to reduce cuprous oxide particles in the coating film
Implementation Method 2
the coating film is sintered by heating or photoirradiation
Data Source
AI summary
Provided is a photosintering composition including: a cuprous oxide particle comprising at least one additive element selected from the group consisting of tin, manganese, vanadium, cerium, iron and silver; a metal particle having a volume resistivity at 20° C. of 1.0×10−3 ω·cm or less; and a solvent.