Photostructured Ceramic 3D Interconnects and MEMS Encapsulation

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Solution Overview

Problem

Existing photostructurable ceramic manufacturing processes lack a method to effectively encapsulate and protect delicate three-dimensional microelectromechanical systems (MEMS) devices within a protective volume, leading to potential damage during handling and integration due to surface tension forces and limited ability to create complex three-dimensional electrical conducting structures.

Innovation Solution

A fabrication process that forms internal structures within a photostructurable ceramic volume using laser exposure and acid treatments to create plumbing for device insertion or in-situ transformation, allowing for the creation of complex three-dimensional interconnects and encapsulation of devices within a glass or ceramic medium, enabling true three-dimensional fabrication and protection of microelectromechanical systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conformal spray or coating approach is used to encapsulate delicate devices, then device protection is provided, but surface tension forces during drying phase may destroy the fragile device

Engineering Contradiction:

Improvedevice protectionVSAvoidsurface tension forces

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses a sol-gel process with liquid precursor solutions as an intermediary method to deposit protective coatings. The slurry is applied and then undergoes chemical transformation to form a solid protective layer, avoiding the direct surface tension issues of conventional spray drying while achieving device encapsulation and protection

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transforms the physical state of the coating material from liquid slurry to solid protective layer through sol-gel chemical reactions and controlled drying. This parameter change allows the coating to be applied in a liquid state that is less harmful to delicate devices, then converted to a protective solid state after application

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If repetitive two-dimensional metallization stacking is used, then multilevel conducting lines can be laid out, but true three-dimensional structures such as coils and horn antennas cannot be fabricated

Engineering Contradiction:

Improvemultilevel conducting linesVSAvoidthree-dimensional structures

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent transitions from two-dimensional lithographic patterning to true three-dimensional structure fabrication using direct laser writing and other 3D manufacturing techniques. This enables the creation of complex three-dimensional conducting structures such as coils, inductors, and horn antennas that cannot be achieved with planar stacking methods

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent replaces conventional mechanical lithographic patterning processes with direct energy-based methods such as laser writing and field-assisted deposition. These methods enable direct three-dimensional structuring without the limitations of sequential two-dimensional layer stacking

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If complex high aspect ratio microelectrical structures are constructed, then true three-dimensional structures can be created, but processing complexity and handling difficulty increase

Engineering Contradiction:

Improvethree-dimensional structuresVSAvoidprocessing techniques

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple fabrication steps into integrated processes. For example, direct laser writing simultaneously defines the three-dimensional geometry and activates the material properties in a single step, reducing the overall processing complexity despite creating complex structures

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent performs preliminary structuring and material deposition before final device assembly and handling. Complex three-dimensional structures are pre-formed within the substrate using direct writing methods, reducing the need for subsequent complex manipulation and assembly steps

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the creation of complex three-dimensional structures with high aspect ratios, protecting fragile devices from damage and allowing for easy handling, while providing a platform for integrated systems with enhanced electrical conductivity and environmental resistance.

Implementation Method 1

Photostructured chemical devices and methods for making same

Methodology Applied

Scientific EffectPhotostructuring: Photopolymerisation

Data Source

PatentUS10099918B2Photostructured chemical devices and methods for making same

Publication Date: 2018.10.16 AEROSPACE CORP

AI summary

A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.