Photostructured Ceramic Encapsulation for MEMS Reliability
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Solution Overview
Problem
Existing photostructurable ceramic manufacturing processes lack a method to effectively encapsulate and interconnect delicate microelectromechanical systems (MEMS) devices within a protective volume, leading to damage during handling and assembly due to two-dimensional metallization limitations and surface tension issues during drying.
Innovation Solution
A fabrication process that forms internal structures within a photostructurable ceramic volume using plumbing features, allowing for the creation of three-dimensional interconnections and device materials through insertion or in-situ transformation, enabling the encapsulation of complex components with high aspect ratios and miniaturized features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conformal spray or coating approach is used to protect delicate structures, then device encapsulation is achieved, but device destruction occurs due to surface tension forces during drying phase
Solution Approach 1:
The patent extracts the harmful drying phase from the encapsulation process by using a non-aqueous coating material that does not require drying. The coating material is applied and cured without undergoing a drying process that generates surface tension forces, thereby eliminating the source of device destruction while maintaining encapsulation protection.
Solution Approach 2:
The patent changes the physical-chemical parameters of the coating material from aqueous-based (requiring drying) to non-aqueous-based (curing without drying). This parameter change eliminates surface tension forces during the coating process while still providing the necessary protective encapsulation for delicate microelectromechanical structures.
2Ease of manufacture
If two-dimensional metallization processing is used, then manufacturing simplicity is maintained, but complex three-dimensional interconnections cannot be formed
Solution Approach 1:
The patent transitions from two-dimensional metallization processing to three-dimensional interconnection structures by forming vertical vias and stacked conductive patterns. This dimensional change enables complex three-dimensional electrical conducting structures such as coils, inductors, and horn antennas while maintaining compatibility with existing lithography techniques through the use of sacrificial materials and selective etching processes.
3Adaptability or versatility
If high aspect ratio microelectrical structures are constructed, then device functionality is improved, but handling damage occurs during automated pick and place operations
Solution Approach 1:
The patent applies a protective coating material to the delicate high aspect ratio structures before they are subjected to automated handling. This coating acts as a cushioning layer that protects the fragile structures from mechanical damage during pick and place operations, enabling the structures to maintain their functionality without suffering handling-induced destruction.
Solution Approach 2:
The patent embeds the delicate microelectromechanical structures within an encapsulating coating material that provides protective confinement. This nesting approach surrounds the fragile high aspect ratio structures with a protective matrix that prevents handling damage while allowing the structures to maintain their three-dimensional functionality.
4Reliability
If conformal coating is applied to protect delicate structures, then encapsulation is achieved, but induced stresses during drying phase cause device destruction
Solution Approach 1:
The patent removes the drying phase from the coating process by using a non-aqueous coating material that cures without requiring evaporation of solvent. This extraction of the drying phase eliminates the source of induced stresses that would otherwise destroy delicate microelectromechanical structures during encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of fully encapsulated, three-dimensional microelectromechanical systems with high aspect ratios, protected from environmental damage, suitable for handling and integration without risk of destruction, while allowing for complex interconnections and miniaturization.
Implementation Method 1
Photostructurable glass ceramic materials are used to make internal structures having internal functional surfaces defined during a photostructuring process
Data Source
AI summary
A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices including chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.