Serial Differential PHY Link Control for Flit Blocking Tasks

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current interconnect architectures in high-performance computing systems face challenges in meeting the increasing demand for bandwidth and power efficiency, particularly in servers and mobile devices, as they struggle to scale effectively with the growing complexity of computing components and the need for faster communication between processors and devices.

Innovation Solution

The development of a High Performance Interconnect (HPI) architecture that employs a layered protocol stack, including a transaction layer, link layer, and physical layer, with features such as credit-based flow control, virtual channels, and a coherence protocol to support cache-coherent systems, enabling efficient data transfer and management across multiple devices and processors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If traditional multi-drop buses are used, then device complexity is reduced, but communication performance and bandwidth deteriorate

Engineering Contradiction:
Improveinterconnect architecture complexityVSAvoidcommunication bandwidth
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The interconnect architecture is segmented into multiple independent point-to-point links instead of a shared bus. Each link has dedicated bandwidth and can operate independently, eliminating the bandwidth contention inherent in shared multi-drop buses while maintaining manageable complexity through modular link design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The architecture transitions from a two-dimensional shared bus structure to a three-dimensional hierarchical topology with multiple levels (L0, L1, L2) and multiple simultaneous communication paths. This dimensional expansion provides parallel communication channels that dramatically increase bandwidth without proportionally increasing complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If processing power and number of devices are increased, then computational capability is improved, but communication requirements and power consumption worsen

Engineering Contradiction:
Improvecomputational capabilityVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The interconnect supports dynamic link width adjustment where links can operate at different widths (e.g., 128-bit, 64-bit) depending on bandwidth demands. This allows the system to allocate power and bandwidth resources dynamically - using full width for high-performance computing tasks and reduced width for less demanding operations, thereby reducing average power consumption while maintaining peak computational capability.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The communication infrastructure is divided into multiple independent point-to-point links that can be activated or deactivated based on actual communication needs. This segmentation allows the system to reduce power consumption by keeping fewer links active during low-demand periods while maintaining the capability to scale up when computational tasks require high bandwidth.

Inventive Principle:
Principle #1Segmentation

3Productivity

If link width is increased, then data transfer bandwidth is improved, but signal integrity and manufacturing precision worsen

Engineering Contradiction:
Improvedata transfer bandwidthVSAvoidsignal integrity control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Instead of building a single wide link, the architecture uses multiple narrower point-to-point links that can be aggregated to achieve the required total bandwidth. Each narrow link maintains excellent signal integrity and is easier to manufacture, while the collective bandwidth of multiple links provides the necessary data transfer capacity. This segmentation approach trades a single wide link for multiple manageable narrow links.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11269793B2High performance interconnect
Publication Date: 2022.03.08 INTEL CORP
  • US11269793B2 patent drawing
  • US11269793B2 patent drawing
  • US11269793B2 patent drawing

AI summary

A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.