Physics-Based 3D Modeling for Electronic Design Analysis
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Solution Overview
Problem
Conventional approaches to electronic design analysis face challenges with large layout artwork sizes, limited computational capacity, and inadequate resolution in modeling modern electronic circuits, particularly for 3D-ICs and non-planar transistors, leading to inaccurate and incomplete analysis results.
Innovation Solution
The method involves generating a reduced 3D model from layout artwork using physics-based techniques, allowing for detailed analysis of specific regions within the electronic design, with customizable granularity and resolution, and incorporating existing 3D models to enhance computational efficiency and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If conventional approaches model entire electronic designs with layout artwork, then analysis coverage is improved, but computational capacity is exceeded due to enormous data sizes
Solution Approach 1:
The patent divides the electronic design into hierarchical levels (circuit board level, package level, chip level, and device level). Each level is modeled separately with appropriate detail, allowing comprehensive analysis coverage without overwhelming computational resources at any single level. The layout artwork is processed segment by segment according to the hierarchical structure.
Solution Approach 2:
The patent transitions from traditional 2D layout artwork analysis to 3D physical modeling. By adding the third dimension (vertical stacking in 3D-ICs, package structures, and circuit board layers), the system can analyze spatial relationships and physical effects (thermal, electromagnetic) that cannot be captured in 2D, while managing complexity through hierarchical abstraction.
2Device complexity
If conventional approaches model small discrete components, then computational capacity is preserved, but analysis accuracy deteriorates due to lack of real-world context
Solution Approach 1:
The patent implements nested modeling where device-level models are embedded within chip-level models, which are embedded within package-level models, and finally within circuit board-level models. Each level provides contextual information to the nested levels, ensuring that small component analysis occurs within the appropriate real-world context while maintaining computational feasibility through progressive abstraction.
3Device complexity
If conventional electromagnetic analyses use pseudo-3D methodologies, then computational complexity is reduced, but analysis precision deteriorates due to empirical corrections
Solution Approach 1:
The patent replaces pseudo-3D empirical methodologies with genuine 3D physics-based electromagnetic analysis. By implementing full 3D modeling capabilities that directly simulate electromagnetic field propagation and interaction in three-dimensional space, the system eliminates the need for empirical corrections and achieves accurate predictions of electromagnetic interference, signal integrity, and antenna performance in modern 3D-IC and multi-layer designs.
4Measurement precision
If detailed 3D models are generated for modern electronic designs, then analysis resolution is improved, but processing time increases due to enormous model sizes
Solution Approach 1:
The patent performs preliminary processing of layout artwork to generate optimized 3D models before detailed analysis. This includes automated extraction of geometric information, classification of structures by functional hierarchy, and pre-computation of spatial relationships. By preparing the model structure in advance with appropriate level-of-detail assignments, the system enables high-resolution analysis of critical regions without requiring excessive processing time for the entire design.
Data Source
AI summary
Various techniques implement an electronic design with physical simulations using layout artwork. The approximate behaviors of the electronic design are determined. A region in the electronic design is identified. A first three-dimensional model is identified, if pre-existing, or generated, if non-existing, for the region in the electronic design. The behaviors of the region is determined using at least physics-based techniques or methodologies that are preconditioned upon at least a portion of the approximate behaviors determined for the electronic design.