PIC Attachment Cavity for IME Dispensing

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Solution Overview

Problem

Existing solutions for attaching silicon photonic integrated circuits (PICs) to optical connectors face challenges with small hard gaps in the optical path, making it difficult to dispense index matching epoxy (IME) and leading to potential overflow on waveguides.

Innovation Solution

The proposed solution involves creating a cavity at a specific location near the trench alongside an optical facet of the PIC die, filling the trench and cavity with IME, and using a snap cure adhesive between the PIC and the optical connector. This architecture improves the attachment process by facilitating better IME distribution and adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a small hard gap is used in the optical path between the optical connector and PIC die, then alignment precision is improved, but it becomes difficult to dispense index matching epoxy (IME) and may cause overflow on waveguides

Engineering Contradiction:

Improvealignment precisionVSAvoidease of IME dispensing

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent divides the gap region into two separate regions: a first region between the optical connector and optical facet, and a second region (trench) between the optical facet and waveguide. This segmentation allows different IME dispensing approaches for each region, enabling precise control while maintaining alignment accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different structural characteristics to different parts of the gap region. The first region has specific depth and width dimensions optimized for IME dispensing, while the second region (trench) has dimensions optimized for preventing overflow. This local differentiation resolves the contradiction between precision and ease of manufacture.

Inventive Principle:

Principle #3Local quality

2Productivity

If traditional attachment methods are used, then manufacturing simplicity is maintained, but throughput time per wafer is reduced

Engineering Contradiction:

Improvethroughput time per waferVSAvoidattachment architecture complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent incorporates the trench structure and IME dispensing features into the PIC die fabrication process itself, before the attachment step. This preliminary action eliminates the need for complex post-attachment processing and enables higher throughput while maintaining manufacturing simplicity through integration.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves the throughput time per wafer, with some scenarios showing a three-fold increase compared to traditional methods, while maintaining accuracy, yield, cost, reliability, and in-use strength of the optical connector.

Implementation Method 1

an adhesive material between the semiconductor substrate and the optical connector component

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

an index matching epoxy (IME) in the gap between the optical facet and the optical connector component

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS20250110285A1ARCHITECTURES AND METHODS FOR ATTACHING PHOTONIC INTEGRATED CIRCUITS (PICs) TO OPTICAL CONNECTORS

Publication Date: 2025.04.03 INTEL CORP

AI summary

Architectures and methods for attaching photonic integrated circuits (PICs) to optical connectors. The architectures are characterized by (1) a cavity at a specific location with respect to a trench alongside an optical facet of the PIC die, (2) index matching epoxy (IME) in the trench and in the cavity, and (3) the use of a snap cure adhesive between the PIC and the optical connector.