Multi-Substrate PIC Coupling for Precise Fiber Alignment
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Solution Overview
Problem
The challenge in integrating CMOS and photonic components into a single device is the difficulty in forming surface features for fiber attachment after other portions of the PIC die are fabricated, making it hard to account for the location of these features during fabrication.
Innovation Solution
A multi-substrate approach where a groove is formed in a first substrate independently of the PIC structure, aligned with a cavity in a second substrate, allowing optical fiber attachment after the substrates are coupled, using a hybrid of metallic and insulative bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If surface features for fiber attachment are formed after other portions of the PIC die are fabricated, then the fiber attachment location can be determined, but it becomes difficult to account for the location of these features when fabricating certain active portions of the PIC structure
Solution Approach 1:
The device is divided into two separate substrates: a first substrate for forming the groove and a second substrate for forming the PIC structure. This segmentation allows independent fabrication of each substrate without constraints, resolving the contradiction between precise fiber attachment location and ease of PIC fabrication.
Solution Approach 2:
The groove for fiber attachment is formed in the first substrate before coupling to the second substrate. This preliminary action ensures that the fiber attachment location is predetermined and precise, while the PIC structure can be fabricated on the second substrate without constraints.
2Adaptability or versatility
If a multi-substrate approach is used with groove and cavity alignment, then fiber attachment flexibility is improved, but substrate coupling complexity increases
Solution Approach 1:
The device is segmented into two substrates with distinct functions: the first substrate handles fiber attachment (with groove) while the second substrate handles PIC structure (with cavity). This segmentation provides flexibility in fiber attachment while keeping each substrate's design relatively simple.
Solution Approach 2:
The coupling interface between the two substrates acts as an intermediary that aligns the groove and cavity features. This intermediary mechanism enables flexible fiber attachment while managing the overall complexity through a standardized coupling approach.
Data Source
AI summary
Embodiments of the disclosure provide a multi-substrate coupling for photonic integrated circuits (PICs). Structures of the disclosure may include a first substrate having a first surface. The first surface includes a groove therein. A second substrate has a second surface coupled to the first surface. The second substrate includes a cavity substantially aligned with the groove of the first surface, and a photonic integrated circuit (PIC) structure horizontally distal to the cavity.