Optically Bridged PIC-EIC Package with Temperature-Compensated Modulators
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Solution Overview
Problem
Existing electrical interconnects in semiconductor dies consume high power, have pin count limitations, and inefficiently transport data to the edge of the chip, making it difficult for AI computing hardware to meet the demands of AI applications.
Innovation Solution
Implementing optical multi-die interconnect bridges (OMIBs) with temperature-stabilized modulators that bridge semiconductor dies, allowing photonic data transport directly to the central region of the die, reducing power consumption and latency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If electrical interconnects are used to transport data among processor ICs and memory ICs, then data transfer can be achieved, but power consumption is high and pin count is limited
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects using photonic ICs. Optical signals substitute for electrical signals, enabling data transport without the pin count limitations and high power consumption of electrical systems. The photonic IC includes optical modulators, waveguides, and photodetectors that transmit data as light through optical fibers or free space.
Solution Approach 2:
The patent introduces an optical intermediary layer (photonic IC) between processor ICs and memory ICs. This intermediary converts electrical signals to optical signals for transmission, then converts them back to electrical signals at the destination. This intermediary enables high-bandwidth data transfer with lower power consumption and without pin count constraints.
2Productivity
If electrical interconnects transport data to the edge of the chip, then data can be moved, but the process is inefficient and increases latency
Solution Approach 1:
The patent replaces electrical signal propagation with optical signal propagation. Optical signals travel faster and can be transmitted through dedicated waveguide paths that provide direct routing between components, eliminating the need to route signals to chip edges. This substitution dramatically improves data transfer efficiency and reduces latency.
Solution Approach 2:
The patent transitions from two-dimensional electrical routing on the chip surface to three-dimensional optical waveguide routing. Optical waveguides can be routed through the bulk of the substrate, providing direct vertical and lateral paths between components without being constrained by the chip edge, thereby reducing transmission distance and latency.
3Adaptability or versatility
If temperature-stabilized modulators are implemented in OMIBs, then operating temperature range is extended, but device complexity increases
Solution Approach 1:
The patent changes the temperature sensitivity parameter of the modulator by introducing temperature compensation mechanisms. These mechanisms adjust the modulator's operating point or characteristics based on temperature variations, compensating for thermal drift and extending the usable temperature range. The compensation may involve additional control circuits, temperature sensors, or feedback loops that dynamically adjust modulator parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
OMIBs provide faster and more efficient data transfer by carrying data photonically to the point of compute, reducing electrical pipeline stages and utilizing less power, thereby enabling complex AI systems.
Implementation Method 1
a modulator with a first modulator input; and an interconnect region located within two millimeters (2 mm) from the modulator
Implementation Method 2
The modulator is configured to receive a temperature-dependent bias voltage. The temperature dependence of the temperature-dependent bias voltage inversely matches the temperature dependence of the modulator over an extended temperature range.
Data Source
AI summary
A package comprises a photonic integrated circuit (PIC) with a modulator having a first modulator input, and a PIC interconnect region within two millimeters or fifty microns from the modulator. Additionally, an electric integrated circuit (EIC) is included with a driver circuit and an EIC interconnect region within two millimeters or fifty microns from the driver circuit. The driver circuit is electrically connected to the first modulator input via the EIC interconnect region, a first metal interconnect, and the PIC interconnect region. The modulator receives a temperature-dependent bias voltage, where the temperature dependence of the bias voltage inversely matches the temperature dependence of the modulator across an extended temperature range.