PIC Package Fiber Alignment Structure for Wide-Bandwidth Coupling
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving wide bandwidth and reducing alignment errors, particularly in the vertical direction, when integrating photonic integrated circuits and optical fibers.
Innovation Solution
The semiconductor package design includes a package substrate with alignment holes and grooves, a photonic integrated circuit chip with a photo-electron conversion unit and edge couplers, and an optical fiber connector with a frame and alignment pin, allowing for precise alignment and mounting of optical fibers, which enhances bandwidth and reduces vertical alignment errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If optical fibers are integrated with photonic integrated circuit chips in semiconductor packages, then bandwidth is improved, but vertical alignment error increases
Solution Approach 1:
The patent applies preliminary action by pre-forming grooves on the PIC chip surface and align holes on the substrate before mounting the chip. These pre-formed structures serve as alignment guides that automatically position the optical fibers correctly when the chip is mounted, eliminating the need for post-mounting alignment adjustments and reducing vertical alignment errors while maintaining wide bandwidth
Solution Approach 2:
The patent introduces intermediary structures (grooves and align holes) that mediate between the optical fibers and the PIC chip. These intermediary features act as mechanical guides and positioners, ensuring precise vertical alignment during the mounting process without requiring complex alignment procedures, thus resolving the contradiction between achieving wide bandwidth and minimizing alignment errors
2Manufacturing precision
If alignment structures are added to improve vertical alignment, then manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the alignment function into separate, simple components: grooves formed on the PIC chip surface and align holes formed on the substrate. These segmented alignment features are independently formed using standard semiconductor fabrication processes, keeping each component simple while collectively achieving precise vertical alignment without increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a wide bandwidth for optical signal transmission and significantly reduces vertical alignment errors, ensuring accurate and efficient optical signal input/output operations.
Implementation Method 1
a photo-electron conversion unit including an edge coupler
Data Source
AI summary
A semiconductor package includes a package substrate including an alignment hole extending inwardly from a side surface of the package substrate, a photonic integrated circuit chip disposed on the package substrate, the of the package substrate chip including a groove extending inwardly from a side surface of the PIC chip and a photo-electron conversion unit including an edge coupler, and an optical fiber connector including a frame, an optical fiber mounted in the groove of the of the package substrate chip and passing through the frame, and an alignment pin extending from the frame to an inside of the alignment hole, wherein the edge coupler is located at one end of the photo-electron conversion unit.