Photonic Integrated Circuit Grating Collimation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Scanning display systems and structured light illuminators are large and costly due to their discrete component nature, with refractive collimators adding to size and expense, and alignment of these components is complex.
Innovation Solution
A photonic integrated circuit (PIC) assembly with integrated optical conditioning elements, including a light source, waveguide, and gratings, which conditions light for use in display and depth sensing systems, reducing size and alignment challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete optical components (collimators, beam combiners, MEMS mirrors) are assembled together to form a scanning display system, then the system can achieve the required optical functionality, but the system size becomes large and assembly complexity increases
Solution Approach 1:
The patent integrates multiple discrete optical components (light source, collimator, beam combiner, and MEMS scanning mirror) into a single photonic integrated circuit (PIC) device. The light source, waveguide, and scanning mirror are fabricated together on the same semiconductor substrate, eliminating the need for separate assemblies and reducing overall system volume while maintaining all required optical functions.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of discrete optical components to a planar two-dimensional integrated circuit structure. By fabricating all optical elements on a flat semiconductor substrate using standard semiconductor manufacturing processes, the system achieves compactness in the vertical dimension while maintaining optical functionality through carefully designed waveguide and grating structures.
2Reliability
If discrete optical components are assembled together to form a scanning display system, then the system can achieve the required optical functionality, but the assembly cost and complexity increase
Solution Approach 1:
The patent combines multiple discrete optical components into a single integrated photonic device fabricated using standard semiconductor manufacturing processes. This integration eliminates the need for complex manual assembly of separate components, reducing both assembly complexity and cost while ensuring precise alignment and consistent optical performance.
Solution Approach 2:
The patent replaces mechanical assembly of discrete optical components with a semiconductor fabrication process. Instead of manually aligning and mounting separate optical elements, all components are patterned, deposited, and etched together on the substrate using photolithography and other semiconductor manufacturing techniques, eliminating mechanical assembly complexity entirely.
3Illumination intensity
If refractive collimators with multi-element optics are used in scanning display systems, then the optical conditioning performance is improved, but the system size and cost increase
Solution Approach 1:
The patent replaces traditional refractive collimator optics with a photonic crystal grating structure fabricated using semiconductor manufacturing techniques. This grating-based approach provides the necessary collimation and beam conditioning functions without requiring bulky multi-element refractive optics, significantly reducing system size while maintaining optical performance.
Solution Approach 2:
The patent changes the fundamental operating parameters of the optical conditioning element by transitioning from refractive index-based lens systems to diffraction-based grating structures. By carefully controlling the grating period, depth, and geometry, the system achieves effective collimation and beam shaping with a much more compact footprint than traditional refractive optics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PIC assembly enables a compact, cost-effective solution for generating light in display and depth sensing systems, simplifying alignment and reducing system size while maintaining optical functionality.
Implementation Method 1
The PIC comprises a light source coupled to the substrate. The light source is configured to emit light.
Implementation Method 2
The PIC comprises a waveguide section that is configured to direct the incoupled light within the core along a first direction (e.g., parallel to a surface of the substrate).
Implementation Method 3
The PIC comprises an optical conditioning section that includes one or more gratings that are part of the core and are configured to condition the incoupled light and output the conditioned light in a second direction different than the first direction (e.g., perpendicular to the surface of the substrate).
Data Source
AI summary
A photonic integrated circuit assembly generates light for use in a display system or a depth sensing system. The photonic integrated circuit assembly includes optical conditioning elements integrated into a photonic integrated circuit. The photonic integrated circuit includes one or more light sources on the photonic integrated circuit. The photonic integrated circuit includes a waveguide and one or more gratings located in a core of the photonic integrated circuit. The gratings may collimate and/or collocate light emitted by the light source. The photonic integrated circuit may include a beam shaping element integrated into the photonic integrated circuit. A MEMS scanner may use the collocated and/or collimated light emitted by the photonic integrated circuit to generate a display for a user or to generate a structured light pattern for use in a depth sensing system.