PIC Die Packaging Using Magnetic Force Inducers for Fiber Alignment
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Solution Overview
Problem
Current photonic integrated circuit (PIC) die packaging faces challenges in achieving high alignment accuracy and uniform force application for optical fibers, as well as optimal UV adhesive curing, due to the limitations of pick-and-place tools and glass lids which can block UV radiation and cause adhesive contamination.
Innovation Solution
The use of a magnetic force inducer (MFI) positioned over optical elements to forcibly direct them into V-groove fiber optic receptacles, allowing for precise alignment and UV adhesive curing without blocking UV radiation, and potentially remaining in the PIC package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If glass lids are used to apply downward force on optical fibers, then alignment accuracy is improved, but UV radiation is blocked causing incomplete adhesive curing
Solution Approach 1:
The patent replaces the mechanical glass lid system with a magnetic field-based force application system. Magnets positioned on the pickup tool tip generate magnetic forces that act on ferromagnetic materials integrated into the optical fiber assembly, applying the necessary downward force without physical contact. This eliminates the UV blocking problem while maintaining alignment accuracy.
Solution Approach 2:
The patent introduces ferromagnetic materials as intermediaries between the magnetic field source and the optical fiber. These ferromagnetic elements serve as force transmission mediators that convert magnetic field energy into mechanical force, enabling non-contact application of pressure to maintain fiber alignment during adhesive curing.
2Manufacturing precision
If pick-and-place tool tips are used to apply force on optical fibers, then alignment is maintained, but adhesive contamination of the tool occurs
Solution Approach 1:
The patent eliminates direct mechanical contact between the pick-and-place tool and the optical fiber by substituting magnetic force application. The magnetic field generates forces that act remotely on ferromagnetic materials attached to or integrated with the optical fiber, preventing adhesive contamination of the tool while maintaining precise position alignment during the curing process.
3Manufacturing precision
If mechanical force is applied to optical fibers during adhesive curing, then alignment is maintained, but UV curing is inhibited due to shadowing effects
Solution Approach 1:
The patent replaces mechanical force application with magnetic field-based force generation. Magnets positioned on the pickup tool tip create magnetic forces that act on ferromagnetic materials in the optical fiber assembly, maintaining alignment without physical obstruction. This eliminates shadowing effects and allows complete UV radiation transmission for efficient adhesive curing.
Solution Approach 2:
The patent uses ferromagnetic materials as intermediaries that transmit magnetic forces to the optical fiber components. These intermediaries enable force application without direct mechanical contact from the tool, removing physical barriers to UV radiation and allowing full curing efficiency while maintaining alignment through magnetic force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures high alignment accuracy, prevents adhesive contamination, and allows for complete UV curing of the adhesive, improving the reliability and efficiency of the PIC die packaging process.
Implementation Method 1
a magnetic force inducer (MFI) positioned over the optical element... MFI positioned on at least one of the plurality of optical fibers to forcibly direct at least one of the plurality of optical fibers into position
Data Source
AI summary
A photonic integrated circuit (PIC) package includes a PIC die including electro-optical circuitry having an optical waveguide system therein and a V-groove fiber optic receptacle on a first surface thereof. The V-groove fiber optic receptacle positions an optical element, e.g., optical fiber(s), for optical coupling with the optical waveguide system. An optical element is operatively coupled to the optical waveguide system and positioned in the V-groove fiber optic receptacle. A magnetic force inducer (MFI) is positioned to forcibly direct the optical element into position in the V-groove fiber optic receptacle in response to application of a magnetic field from a direction opposite the V-groove fiber optic receptacle in the first surface. During assembly, a magnetic field may be applied to the MFI to generate the magnetic force. After adhering the optical element, the magnetic field may remain to allow the PIC package to be moved with more security. The MFI may remain with and become part of the finished assembly.