Photonic Integrated Circuit with Integrated OTRx Front-End
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Solution Overview
Problem
Current photonic transceivers, particularly those using 2.5D hybrid integration, face challenges in achieving high bandwidth due to parasitic issues and the need for different OTRx front-end circuitries for various EICs, which complicates the fabrication process and limits performance.
Innovation Solution
Integrating OTRx front-end circuitry with the PIC and electrically interconnecting it to the EIC on an interposer, allowing for the use of a single design for different EICs and reducing parasitic effects, thus simplifying the fabrication process and enhancing bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If OTRx front-end circuitry is integrated with PIC, then bandwidth is improved and parasitic effects are reduced, but device complexity increases
Solution Approach 1:
The patent integrates the OTRx front-end circuitry directly with the PIC on the same substrate, merging previously separate components into a unified structure. This integration eliminates the need for external connections and reduces parasitic effects, thereby improving bandwidth while managing device complexity through systematic design.
Solution Approach 2:
The integrated OTRx front-end circuitry is designed to be universally compatible with different EICs through standardized interfaces on the interposer. This multi-functional design allows the same integrated structure to serve multiple purposes and work with various electronic integrated circuits, improving bandwidth without proportionally increasing complexity.
2Adaptability or versatility
If different OTRx front-end circuitries are designed for various EICs, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent creates a universal OTRx front-end circuitry design that can interface with multiple types of EICs through standardized connections on the interposer. This single adaptable design replaces the need for multiple specialized circuitries, improving adaptability while significantly simplifying the manufacturing process.
Solution Approach 2:
The integrated OTRx front-end circuitry design can be replicated and reused across different photonic devices and EIC configurations. This copying approach allows the same proven design to be manufactured repeatedly without requiring new designs for each EIC type, reducing manufacturing complexity while maintaining adaptability.
3Ease of manufacture
If OTRx front-end circuitry is integrated with PIC, then fabrication process is simplified, but device complexity increases
Solution Approach 1:
By merging the OTRx front-end circuitry and PIC into a single integrated structure on the same substrate, the patent reduces the number of separate fabrication steps and assembly operations. This consolidation simplifies the overall fabrication process while the systematic integration methodology manages the increased device complexity.
Solution Approach 2:
The integration is achieved through segmented fabrication processes that build different functional blocks separately before combining them on the interposer. This segmentation allows each component to be optimized independently while the overall integration simplifies the final assembly and reduces parasitic effects, balancing fabrication ease with device complexity.
Data Source
AI summary
Examples include a photonic device including a photonic integrated circuit (PIC), an optical transceiver (OTRx) front-end circuitry integrated with the PIC, an electronic integrated circuit (EIC) and an interposer. The PIC and the EIC are disposed on the interposer. The EIC is electrically interconnected to the OTRx front-end circuitry in the PIC. Some examples include a method of fabricating a photonic device.