Photonic Integrated Circuit Packaging Architecture

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Solution Overview

Problem

Current photonic integrated circuit (PIC) packaging architectures face challenges in achieving high-density, high-bandwidth electrical communication and simultaneous optical access, with existing methods consuming significant space and limiting electrical interconnect density due to the need for substantial PIC exposure for fiber coupling, which complicates manufacturing and increases costs.

Innovation Solution

A photonic packaging architecture that includes a package substrate, an IC, an insulating material, a PIC with an active side and a lateral side perpendicular to the active side, and an optical lens coupled to the PIC on the lateral side, allowing for electrical coupling to the substrate and IC while maintaining optical accessibility through the use of optical elements like waveguides and grating couplers, and employing high-density interconnects to reduce footprint and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If substantial PIC exposure is used for fiber coupling, then optical access is maintained, but electrical interconnect density is limited and space consumption increases

Engineering Contradiction:

Improvespace consumptionVSAvoidelectrical interconnect density

Core Design Contradiction:

Area of stationary objectVSQuantity of substance

Solution Approach 1:

The patent transitions from planar PIC exposure to three-dimensional integration by embedding the PIC within the package substrate. The optical component is positioned at a lateral side of the PIC rather than requiring top-surface exposure, enabling vertical stacking and higher interconnect density in the Z-dimension while maintaining optical coupling through side-access waveguides or grating couplers.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The PIC is nested within the package substrate structure, with the optical component nested at a lateral interface. This nested configuration allows electrical interconnects to be routed through multiple layers above and below the PIC plane, maximizing space utilization and interconnect density without compromising optical access.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Area of stationary object

If high-density interconnects are employed, then footprint is reduced and power consumption decreases, but manufacturing complexity increases

Engineering Contradiction:

ImprovefootprintVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The package substrate is segmented into multiple functional layers, with electrical interconnects distributed across different planes. This segmentation allows high-density routing without requiring complex three-dimensional wiring, as each layer can be manufactured using standard planar processes, thereby reducing overall manufacturing complexity while achieving compact footprint.

Inventive Principle:

Principle #1Segmentation

3Reliability

If PIC is embedded in insulating material, then electrical coupling is improved, but optical access requirements become more stringent

Engineering Contradiction:

Improveelectrical couplingVSAvoidoptical access implementation

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Optical waveguides or grating couplers are introduced as intermediary structures that bridge the embedded PIC and the external optical fiber. These intermediaries are positioned at lateral interfaces where they can couple light to the embedded PIC without requiring the PIC to be exposed on the top surface, thereby maintaining electrical coupling through the insulating material while simplifying optical access implementation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This architecture enables smaller, more efficient PIC packaging with increased electrical interconnect density and reduced power requirements, facilitating faster and more cost-effective optical communication systems by optimizing the integration of electrical and optical components.

Implementation Method 1

an optical lens coupled to the PIC on the lateral side

Methodology Applied

Scientific EffectOptical focusing: Lens

Implementation Method 2

A substantial portion of the active side of the PIC is in contact with the insulating material

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS20230089877A1Photonic integrated circuit packaging architectures

Publication Date: 2023.03.23 INTEL CORP

AI summary

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active surface and an opposing backside, and wherein the PIC is embedded in the insulating material with the active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer and the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC and extending through the insulating material in the second layer.