Integrated Probe for Simultaneous PIC Electrical and Optical Testing
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Solution Overview
Problem
Conventional testing methods for photonic integrated circuits (PICs) require separate optical and electrical alignment systems, consuming significant time and resources, and are prone to misalignment errors.
Innovation Solution
A probe with a membrane having conductive traces and probe tips for electrical testing, integrated with a photonic test assembly for simultaneous optical and electrical testing, allowing substantial alignment with PIC die elements to transmit and detect photonic signals, eliminating the need for separate testing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate optical and electrical alignment systems are used for PIC testing, then comprehensive testing capability is achieved, but testing time and resource consumption increase significantly
Solution Approach 1:
The patent combines separate optical and electrical alignment systems into a single integrated probe structure. The probe includes both electrical contact tips and optical components (such as optical fibers or waveguides) positioned in precise geometric relationships, allowing simultaneous electrical and optical testing through a single alignment action, thereby eliminating the need for sequential alignment operations.
Solution Approach 2:
The integrated probe serves multiple functions simultaneously: it performs both electrical testing through contact tips and optical testing through integrated optical components. This multi-functional design allows a single probe to replace what would traditionally require separate testing equipment, reducing testing time while maintaining comprehensive testing capability.
2Reliability
If separate optical and electrical alignment systems are used for PIC testing, then comprehensive testing capability is achieved, but system complexity and resource requirements increase
Solution Approach 1:
The patent merges multiple testing functions into a single integrated probe structure. By combining electrical contact elements and optical testing elements into one probe, the system reduces the number of separate devices and alignment systems required, thereby reducing overall system complexity and resource requirements while maintaining comprehensive testing capability.
3Reliability
If conventional separate alignment systems are used, then electrical and optical testing can be performed, but misalignment errors occur and testing accuracy decreases
Solution Approach 1:
By integrating optical and electrical components into a single probe structure with predetermined geometric relationships, the patent eliminates the need for separate alignment operations that could introduce misalignment errors. The fixed spatial relationships between electrical contact tips and optical components ensure consistent, accurate positioning relative to the PIC die, improving both alignment precision and testing accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate simultaneous electrical and optical testing of PICs without the need for additional alignment systems, reducing testing time and errors, and ensuring manufacturing quality and performance.
Implementation Method 1
Some wafers may include photonic devices, e.g., photonic waveguides, photonic transmitters and receivers, etc., configured to relay signals through light transmission
Implementation Method 2
the photonic receiver being positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic receiver is configured to detect a photonic output signal from the photonic I/O element
Data Source
AI summary
Embodiments of the disclosure provide a probe structured for electrical and photonics testing of a photonic integrated circuit (PIC) die, the probe including: a membrane having a first surface and an opposing second surface and including conductive traces, the membrane being configured for electrical coupling to a probe interface board (PIB); a set of probe tips positioned on the membrane, the set of probe tips being configured to send electrical test signals to the PIC die or receive electrical test signals from the PIC die; and a photonic test assembly disposed on the membrane and electrically coupled to the conductive traces of the membrane, the photonic test assembly positioned for substantial alignment with a photonic I/O element of the PIC die, wherein the photonic test assembly is configured to transmit a photonic input signal to the photonic I/O element or detect a photonic output signal from the photonic I/O element.