Pick Arm Correction Module for Thermal Drift Compensation
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Solution Overview
Problem
Pick and place devices used in semiconductor manufacturing experience positional errors due to thermal expansion of mechanical parts during long hours of operation at high transfer speeds, affecting accuracy in die sorting and bonding processes.
Innovation Solution
A semiconductor die pick and place device with a handling mechanism featuring a movable pick arm, a reference feature, and a light reflecting module that reflects an image to an image capturing module, allowing the reference feature to appear in focus at a virtual position equivalent to the pick-up or placement location, enabling automatic compensation for positional shifts caused by thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick arm operates at high transfer speeds for long hours, then productivity is improved, but thermal expansion causes positional accuracy to deteriorate
Solution Approach 1:
The system captures images of the reference feature at different positions along the pick arm's path, processes these images to detect thermal expansion-induced position shifts, and feeds this information back to correct the positioning data, thereby maintaining accuracy despite high-speed operation
Solution Approach 2:
The patent replaces direct mechanical measurement methods with an optical imaging system that uses cameras to capture and analyze the position of reference features, substituting mechanical sensing with optical field-based measurement to detect and compensate for thermal expansion
2Duration of action of moving object
If the pick arm operates for long hours, then productivity is improved, but thermal expansion causes the pick head to shift from its original position, deteriorating positioning accuracy
Solution Approach 1:
The system pre-establishes the relationship between image coordinates and physical positions using reference features before actual picking operations begin, creating a calibration framework that can be used throughout extended operating periods to maintain positioning accuracy despite thermal changes
Solution Approach 2:
The system dynamically adjusts positioning parameters based on detected thermal expansion, changing the coordinate transformation parameters from the calibrated values to compensated values that account for thermal drift, thereby maintaining positioning accuracy during extended operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes picking and placing errors, reduces machine downtime, and extends the equipment lifetime by maintaining precision and accuracy in high-speed operations, even after mechanical shifts due to thermal expansion.
Implementation Method 1
a light reflecting module carried by the pick arm; wherein the light reflecting module is operable to reflect an image of the reference feature to an image capturing module
Data Source
AI summary
A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A reference feature is located on the pick arm, and a light reflecting module is carried by the pick arm. The light reflecting module is operable to reflect an image of the reference feature to an image capturing module such that the reference feature appears to the light reflecting module to be in focus at a virtual position that is equivalent to a position at the pick-up location and/or the placement location.