Pick-and-Place Nozzle Cleaning Pad for Stable Vacuum Pickup
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Solution Overview
Problem
The existing cleaning methods for pick-and-place apparatuses in semiconductor device handling machines require unscheduled downtime for manual cleaning, which can damage tools and reduce productivity due to the need for wet chemical processes and mechanical scrubbing, and fail to maintain consistent vacuum strength due to debris accumulation in nozzles and contact surfaces.
Innovation Solution
A cleaning device and method using a cleaning material with a tacky elastomeric pad and intermediate layers with specific geometrical features and properties that can be applied in situ to the pick-and-place apparatus, allowing for regular cleaning of vacuum and suction tools without removing them from the machine, using a non-wet chemical and non-mechanical scrubbing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual cleaning with wet chemical processes and mechanical scrubbing is performed, then debris is removed from nozzles and contact surfaces, but tool damage occurs and downtime increases
Solution Approach 1:
The patent replaces mechanical scrubbing processes with a compliant cleaning material that uses elastic deformation and adhesion to remove debris. The cleaning material compresses against the nozzle and contact surface, then rebounds to peel away contaminants without requiring aggressive mechanical abrasion, thereby preventing tool damage while maintaining cleaning effectiveness
Solution Approach 2:
The patent introduces a compliant cleaning material as an intermediary between the cleaning objective and the tool surface. This material transfers cleaning action through controlled compression and rebound, mediating the interaction between cleaning forces and tool surfaces to achieve debris removal without direct mechanical contact that could cause damage
2Reliability
If pick-and-place apparatus is taken offline for cleaning, then debris is removed from nozzles and contact surfaces, but productivity and throughput are reduced
Solution Approach 1:
The patent enables preliminary cleaning action to be performed during idle periods or between batches without requiring full shutdown. The compliant cleaning material can be quickly applied and removed, allowing maintenance to be performed in advance or during transitions rather than requiring extended offline periods
Solution Approach 2:
The cleaning material is designed to be self-contained and easy to replace, allowing operators to perform cleaning without requiring complex disassembly or specialized procedures. The material serves its own function of cleaning while being simple to install and remove, minimizing interruption to production
3Reliability
If vacuum pick-up tools are removed for cleaning, then thorough cleaning can be performed, but equipment complexity and handling risk increase
Solution Approach 1:
The patent extracts only the cleaning function from the tool assembly, using a separate, disposable cleaning material that contacts only the nozzle and contact surface. This allows cleaning to be performed without removing the entire pick-up tool from the apparatus, simplifying the process while maintaining cleaning effectiveness
Solution Approach 2:
The cleaning material is designed as a disposable component that is inexpensive and easily replaced. Rather than requiring complex, reusable cleaning mechanisms that must be installed and maintained, the patent uses simple, single-use cleaning materials that eliminate the need for complex cleaning system infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables continuous operation of semiconductor device handling machines by maintaining vacuum strength and preventing debris buildup, reducing downtime and tool damage, while effectively cleaning adherent debris from contact surfaces and nozzles without compromising tool integrity.
Implementation Method 1
A pick-and-place apparatus includes a plurality of suction cups, suction inlets, vacuum collets, nozzles, and vacuum pick-up tools for picking up, via vacuum force, semiconductor devices from a device holding tray
Implementation Method 2
The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology
Data Source
AI summary
A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.