Pick and Place Apparatus Pitch Control via Segmented Linear Guides
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Solution Overview
Problem
Conventional pick and place apparatuses for semiconductor devices face limitations in size, operational characteristics, and production efficiency due to the structural constraints of linear motion guide mechanisms, leading to reduced endurance, reliability, and increased maintenance needs, along with high manufacturing costs.
Innovation Solution
The apparatus employs a configuration with larger-sized linear motion guide mechanisms and power transmission shafts, where device holding elements are guided by separate LM guides in the front and rear rows, allowing for improved pitch control and reduced size and weight, while simplifying tolerance management and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sizes of the guide rail and the coupling blocks are increased to firmly couple device holding elements and improve stability, then the endurance and reliability of the pick and place apparatus are enhanced, but the weight of the apparatus increases
Solution Approach 1:
The guide mechanism is divided into multiple separate guide rails and coupling blocks, with each component being independently sized and positioned. This segmentation allows the system to achieve the necessary stability and reliability through distributed support points while keeping individual component sizes and weights optimized, rather than requiring one large monolithic structure.
2Weight of stationary object
If the sizes of the guide rail and the coupling blocks are reduced to decrease apparatus weight, then the apparatus becomes lighter, but the endurance and reliability are reduced
Solution Approach 1:
Multiple guide rails and coupling blocks are combined to work together as an integrated guide system. The collective arrangement of these smaller components provides distributed support and guidance that achieves the necessary reliability and endurance while keeping individual component sizes reduced for lower overall weight.
3Ease of manufacture
If conventional linear motion guide mechanisms are used, then the apparatus can be manufactured with standard components, but the structural constraints lead to reduced operational characteristics and increased maintenance needs
Solution Approach 1:
The guide system is designed with dynamic considerations, allowing the coupling blocks to move smoothly along the guide rails while maintaining proper alignment and contact. The design accommodates operational dynamics and movement patterns, improving reliability and reducing maintenance needs compared to static or rigid guide mechanisms.
Data Source
AI summary
A pick and place apparatus includes a plurality of device holing elements in a predetermined arrangement; a power supply mechanism for supplying a power for controlling a horizontal pitch between the plurality of device holding elements; a power transmission mechanism for delivering the power from the power supply mechanism to the plurality of device holding elements as a translational force in a horizontal direction; a first linear motion guide mechanism for guiding horizontal movements of some of the plurality of device holding elements; and a second linear motion guide mechanism disposed below the first linear motion guide mechanism, for guiding horizontal movements of the other device holding elements. The plurality of device holding elements are slidably coupled to the first and the second linear motion guide mechanism alternately.